High-temperature thermal expansion of six metallic elements measured by dilatation method and X-ray diffraction

In-Kook Suh, H. Ohta, Y. Waseda

Journal of Materials Science 23 (2) 757-760 (1988) · Springer Science and Business Media LLC

DOI: 10.1007/bf01174717

Data: JSON record · id doi:10.1007/bf01174717 · metadata: crossref

Roles in ORCHID

• cited as the original source of values

Systems

Cu

Evidence in ORCHID

1 values in 1 other papers cite this work as their source.

Availability

Read by ORCHID: no (full_text_screened_for_origin). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 435 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (2)

• Thermodynamic Modeling of the Cu-Sb-Se System (2023) [crossref_reference_list]
• Computational approach to the Ag-Ti system (2023) [crossref_reference_list]

Cited for values by (1)

• Thermodynamic Modeling of the Cu-Sb-Se System (2023) — 1 values [orchid_extraction]

Used in (assessments / papers that took values from it) (1)

• Thermodynamic Modeling of the Cu-Sb-Se System (2023) — 1 values [orchid_extraction]