Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste

I. Artaki, A.M. Jackson, P.T. Vianco

Soldering & Surface Mount Technology 7 (2) 27-32 (1995) · Emerald

DOI: 10.1108/eb037896

Data: JSON record · id doi:10.1108/eb037896 · metadata: crossref

Roles in ORCHID

• cited as the original source of values

Systems

Ag–In–Sn

Evidence in ORCHID

1 values in 1 other papers cite this work as their source.

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 13 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (1)

• Thermodynamics of the Sn-In-Ag solder system (1998) [crossref_reference_list]

Cited for values by (1)

• Thermodynamics of the Sn-In-Ag solder system (1998) — 1 values [orchid_extraction]

Used in (assessments / papers that took values from it) (1)

• Thermodynamics of the Sn-In-Ag solder system (1998) — 1 values [orchid_extraction]