Equilibrium solidification of Sn-Ag-Sb thermal fatigue-resistant solder alloys

D. Bruce Masson, Brian K. Kirkpatrick

Journal of Electronic Materials 15 (6) 349-353 (1986) · Springer Science and Business Media LLC

DOI: 10.1007/bf02661884

Data: JSON record · id doi:10.1007/bf02661884 · metadata: crossref

Roles in ORCHID

Systems

Ag–Sb–Sn

Evidence in ORCHID

2 values in 1 other papers cite this work as their source.

Cited values by evidence class
experimental2

Availability

Read by ORCHID: no (full_text_screened_for_origin). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 50 (retrieved 2026-10-23).

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Cited by (Crossref reference lists) (9)

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Used in (assessments / papers that took values from it) (1)