Development of an Ag-Free Sn–Ti–Ni Solder for Low-Temperature Ultrasonic-Assisted Flux-Free Joining of Aluminium Alloys in Air
Liam Hardwick, Mirtunjay Kumar, Yong Xiao, Russell Goodall
Metallurgical and Materials Transactions A 57 (11) 5282-5301 (2026) · Springer Science and Business Media LLC
DOI: 10.1007/s11661-026-08352-3
Data: JSON record · id doi:10.1007/s11661-026-08352-3 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 1440, score 78; systems named in title: Ni–Sn–Ti
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): https://creativecommons.org/licenses/by/4.0 (vor). Crossref is-referenced-by count: 0 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (4)
- Thermodynamic modeling of the Mg–Si–Sn system (2007) [crossref_reference_list]
- Thermodynamic modelling of the Ti–Sn system and calculation of the Co–Ti–Sn system (2007) [crossref_reference_list]
- Calphad assessment of the Ni–Sn–Ti system (2016) [crossref_reference_list]
- Experimental investigation and thermodynamic modeling of the Mg–Sn–Sr ternary system (2021) [crossref_reference_list]