Thermodynamic activity in Zn–Cu–Sn–In liquid solder alloys: a comprehensive analysis using the molecular interaction volume model
Sanjay Kumar Sah, Indu Shekhar Jha, Ishwar Koirala
Welding International 38 (4) 265-276 (2024) · Informa UK Limited
DOI: 10.1080/09507116.2024.2325151
Data: JSON record · id doi:10.1080/09507116.2024.2325151 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 1499, score 75; systems named in title: Cu–In–Sn–Zn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 6 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (4)
- Theoretical investigation of the thermodynamic activities of Zn-In-Sn lead-free solder alloys and the concerned binary alloys (2023) [crossref_reference_list]
- Thermodynamic assessments of the Sn-Zn and In-Zn binary systems (1996) [crossref_reference_list]
- Thermodynamic optimization of the lead-free solder system Bi–In–Sn–Zn (2003) [crossref_reference_list]
- Thermodynamic Calculations of Phase Equilibria, Surface Tension and Viscosity in the In-Ag-X (X=Bi, Sb) System (2004) [crossref_reference_list]