Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys
Xiaojun Sun, Jie He, Bin Chen, Lili Zhang, Hongxiang Jiang, Jiuzhou Zhao, Hongri Hao
Journal of Materials Science & Technology 44 201-208 (2020) · Elsevier BV
DOI: 10.1016/j.jmst.2019.10.038
Data: JSON record · id doi:10.1016/j.jmst.2019.10.038 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 2642, score 68; systems named in title: Cu–Fe–Zr
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 55 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (6)
- The Fe-Cu system: A thermodynamic evaluation (1995) [crossref_reference_list]
- Liquid immiscibility in copper-iron and copper-cobalt systems in the supercooled state (1958) [crossref_reference_list]
- Thermodynamic description of the Al–Fe–Zr system (2008) [crossref_reference_list]
- ‘Thermodynamic assessment of the Ag-Zr and Cu-Zr binary systems (2016) [crossref_reference_list]
- Thermodynamic assessment and glass forming ability prediction of the Zr-Fe-Cu system (2019) [crossref_reference_list]
- Phase equilibria in Fe-Cu-X (X: Co, Cr, Si, V) ternary systems (2002) [crossref_reference_list]