Enthalpies of mixing of liquid systems for lead free soldering: Al–Cu–Sn system
Hans Flandorfer, Meryem Rechchach, A. Elmahfoudi, László Bencze, Arkadij Popovič, Herbert Ipser
The Journal of Chemical Thermodynamics 43 (11) 1612-1622 (2011) · Elsevier BV
DOI: 10.1016/j.jct.2011.05.021
Data: JSON record · id doi:10.1016/j.jct.2011.05.021 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 949, score 96; systems named in title: Al–Cu–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): http://creativecommons.org/licenses/by-nc-nd/3.0/ (vor). Crossref is-referenced-by count: 22 (retrieved 2026-10-23).
Relations
Cited by (Crossref reference lists) (5)
- Thermodynamic Descriptions of the Quaternary Mg–Al–Zn–Sn System and Their Experimental Validation (2020) [crossref_reference_list]
- The thermodynamic reassessment of the binary Al–Cu system (2020) [crossref_reference_list]
- Thermodynamic assessment of the Al–Cu–Zn system, part II: Al–Cu binary system (2015) [crossref_reference_list]
- Update of thermodynamic descriptions of the binary Al-Sn and ternary Mg-Al-Sn systems (2019) [crossref_reference_list]
- Al-Sn-Zn Ternary Phase Diagram Evaluation (2021) [crossref_reference_list]
References (Crossref, publisher-deposited) (3)
- Thermodynamic description of the Cu-Al-Sn system in the copper-rich corner (2002) [crossref_reference_list]
- Algebraic Representation of Thermodynamic Properties and the Classification of Solutions (1948) [crossref_reference_list]
- Heat of Formation of Solid and Liquid Binary Alloys of Copper with Cadmium, Indium, Tin and Antimony at 450° (1956) [crossref_reference_list]