{"cite_as":{"also_cite":["the papers themselves when you use their data (doi / citation of each bibliography record)"],"bibtex":"@misc{orchid_bibliography_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID-Bibliography: papers and typed citation relations}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736021},\n  url       = {https://doi.org/10.5281/zenodo.23736021},\n  note      = {Version 1, machine-extracted}\n}","dataset":"bibliography","doi":"10.5281/zenodo.23736021","licence_note":"Crossref bibliographic metadata: CC0; ORCHID-derived fields (roles, evidence counts, relations): CC BY 4.0","license":"CC-BY-4.0","part_of":{"bibtex":"@misc{orchid_data_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID data: umbrella record of the ORCHID datasets}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736065},\n  url       = {https://doi.org/10.5281/zenodo.23736065},\n  note      = {Version 1, machine-extracted}\n}","doi":"10.5281/zenodo.23736065","text":"R. Arróyave, J. Saal, D. Shin, ORCHID data: umbrella record of the ORCHID datasets (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736065","title":"ORCHID data: umbrella record of the ORCHID datasets","url":"https://doi.org/10.5281/zenodo.23736065"},"release_tag":"v2026.10","status":"Version 1, machine-extracted: roles and evidence counts derive from machine-extracted literature values and link tables; bibliographic fields are Crossref metadata as deposited (DOIs matched from printed references checked against Crossref: doi_match; mismatches dropped).","text":"R. Arróyave, J. Saal, D. Shin, ORCHID-Bibliography: papers and typed citation relations (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736021","title":"ORCHID-Bibliography: papers and typed citation relations","url":"https://doi.org/10.5281/zenodo.23736021","version":"2026.10"},"licence":"Crossref bibliographic metadata: CC0. ORCHID-derived fields (roles, evidence, relations): CC BY 4.0.","paper":{"aliases":["doi:10.1007/bf02653344"],"article_number":null,"authors":[{"family":"Miller","given":"Chad M."},{"family":"Anderson","given":"Iver E."},{"family":"Smith","given":"Jack F."}],"availability":{"open_access_license":null,"pdf_redistributed":false,"read_by_orchid":"no","read_detail":[]},"candidate_systems_inferred":{},"citation":"Chad M. Miller, Iver E. Anderson, Jack F. Smith, A viable tin-lead solder substitute: Sn-Ag-Cu, Journal of Electronic Materials 23(7) (1994) 595-601, https://doi.org/10.1007/bf02653344","citation_printed":null,"container_title":"Journal of Electronic Materials","container_title_short":"J. Electron. Mater.","crossref":{"references_count":13,"references_deposited":13,"retrieved_at":"2026-10-23T14:03:36Z","status":"found"},"doi":"10.1007/bf02653344","doi_check":{"basis":"literature_cited_source","evidence":{"author":"first","journal":"match","title":"unknown","volume_page":"match","year":"ok"},"issues":[],"sources_checked":["literature_cited_source"],"status":"verified"},"doi_match":"verified","doi_url":"https://doi.org/10.1007/bf02653344","evidence_summary":{"cited_as_source":{"by_evidence_class":{"experimental":1},"by_property":{"INVARIANT_TEMPERATURE":1},"by_property_group":{"invariant reaction":1},"n_citing_papers":1,"n_values":1,"n_values_accepted":0}},"id":"doi:10.1007/bf02653344","id_basis":"doi","is_referenced_by_count":251,"is_referenced_by_count_retrieved":"2026-10-23","isbn":[],"issn":["0361-5235","1543-186X"],"issue":"7","issued":"1994-07","key":"p10e15858fcaebaca","language":"en","license":[{"content_version":"tdm","delay_in_days":0,"start":"1994-07-01","url":"https://www.springer.com/tdm"},{"content_version":"vor","delay_in_days":0,"start":"1994-07-01","url":"https://www.springer.com/tdm"}],"metadata_source":"crossref","no_doi":false,"pages":"595-601","provenance":["orchid-data/literature/papers.json"],"publisher":"Springer Science and Business Media LLC","relation_counts":{"cited_by_crossref":{"in":15,"out":1},"cites":{"in":1,"out":0},"used_in_assessment":{"in":0,"out":1}},"role_details":{"cited_original_source":{"basis":"orchid-data/literature (cited source)"}},"roles":["cited_original_source"],"subtitle":null,"systems":["AG-CU"],"title":"A viable tin-lead solder substitute: Sn-Ag-Cu","type":"journal-article","urls":{"html":"https://data.orchid-project.org/bibliography/pages/papers/p10e15858fcaebaca.html","json":"https://data.orchid-project.org/bibliography/papers/p10e15858fcaebaca.json"},"volume":"23","year":1994},"relations":[{"count":null,"direction":"in","edge_id":"ee7d45ce084a1ce38","other":{"doi":"10.1007/978-1-4614-9266-5_3","id":"doi:10.1007/978-1-4614-9266-5_3","key":"p272f31eee60d4b69","title":"Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys","year":2014},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e35284d964b389dc3","other":{"doi":"10.1007/s11661-000-0111-5","id":"doi:10.1007/s11661-000-0111-5","key":"p51aad1f013e36e7e","title":"Tin-silver-copper eutectic temperature and composition","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"edbc70e531d98ad47","other":{"doi":"10.1007/s11664-000-0003-x","id":"doi:10.1007/s11664-000-0003-x","key":"p90f4b1a94a57d93b","title":"Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e7d97d98087f666f7","other":{"doi":"10.1007/s11664-003-0026-1","id":"doi:10.1007/s11664-003-0026-1","key":"p7560b8bc3ff20ec0","title":"Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys","year":2003},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e9d0d3c36ab9b829f","other":{"doi":"10.1007/s11664-006-0029-9","id":"doi:10.1007/s11664-006-0029-9","key":"p327e572191355e05","title":"Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ec9099e6de101cd72","other":{"doi":"10.1007/s11664-009-1070-2","id":"doi:10.1007/s11664-009-1070-2","key":"p71a3faef2d2c4c3a","title":"Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy","year":2010},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e9afa0b8c311d24ec","other":{"doi":"10.1007/s11664-011-1757-z","id":"doi:10.1007/s11664-011-1757-z","key":"p6a75bce90141756d","title":"Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System","year":2011},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e890ea24266133ff9","other":{"doi":"10.1007/s11664-014-3551-1","id":"doi:10.1007/s11664-014-3551-1","key":"p6087cb02cf85ba7b","title":"Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys","year":2015},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e8236852c8e53943b","other":{"doi":"10.1007/s11837-004-0068-8","id":"doi:10.1007/s11837-004-0068-8","key":"p88b8c7524fb8ca6c","title":"Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic","year":2004},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e912c51bac24f7dfb","other":{"doi":"10.1016/j.inoche.2023.110971","id":"doi:10.1016/j.inoche.2023.110971","key":"p5afdab6ea52fea33","title":"Experimental and theoretical partial and integral enthalpies of mixing of liquid quaternary Cu-In-Sn-Zn alloys","year":2023},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ed9608f0f4ea80af5","other":{"doi":"10.1016/j.jallcom.2016.08.035","id":"doi:10.1016/j.jallcom.2016.08.035","key":"pda17608147b5e16a","title":"Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems","year":2016},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ec58856cb5b82bbee","other":{"doi":"10.1557/jmr.2004.0296","id":"doi:10.1557/jmr.2004.0296","key":"pe386568aa399bb42","title":"Phase equilibria of the Ag–Sn–Cu ternary system","year":2004},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"eac12d0362183fa21","other":{"doi":"10.3390/met12101557","id":"doi:10.3390/met12101557","key":"p20d4a437887bcd4c","title":"Thermodynamic Modeling of the Ag-Cu-Sn Ternary System","year":2022},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e6d5a87c2dbf47480","other":{"doi":"10.7121/msi-eureka-10.16022.2.5","id":"doi:10.7121/msi-eureka-10.16022.2.5","key":"pe04576ec85754e55","title":"Ag-Cu-Sn Ternary Phase Diagram Evaluation","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e4c52a4a4842d0a2f","other":{"doi":"10.7121/msi-eureka-10.16022.3.9","id":"doi:10.7121/msi-eureka-10.16022.3.9","key":"p6e0db72bfd9f8e32","title":"Ag-Cu-Sn Ternary Phase Diagram Evaluation","year":2021},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"eff8bc2dff7e1bf14","other":{"doi":"10.1016/0364-5916(93)90011-y","id":"doi:10.1016/0364-5916(93)90011-y","key":"p849a66be2967dac6","title":"A thermodynamic analysis of the AlZn system and phase diagram calculation","year":1993},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"attrs":{"citation_status":{"resolved":1},"evidence_class":{"experimental":1},"n_values":1,"n_values_accepted":0,"property":{"INVARIANT_TEMPERATURE":1},"systems":["AG-CU"]},"count":1,"direction":"in","edge_id":"e068f134db3c0f33f","other":{"doi":"10.1007/s11664-000-0003-x","id":"doi:10.1007/s11664-000-0003-x","key":"p90f4b1a94a57d93b","title":"Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys","year":2000},"provenance":{"dataset":"orchid-data/literature/orchid-literature.jsonl.gz","method":"record.cited_sources (reference printed for the value in the containing paper)","source":"orchid_extraction"},"type":"cites"},{"attrs":{"citation_status":{"resolved":1},"evidence_class":{"experimental":1},"n_values":1,"n_values_accepted":0,"property":{"INVARIANT_TEMPERATURE":1},"systems":["AG-CU"]},"count":1,"direction":"out","edge_id":"e4917565a12d9f6d4","other":{"doi":"10.1007/s11664-000-0003-x","id":"doi:10.1007/s11664-000-0003-x","key":"p90f4b1a94a57d93b","title":"Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys","year":2000},"provenance":{"dataset":"orchid-data/literature/orchid-literature.jsonl.gz","method":"record.cited_sources (reference printed for the value in the containing paper)","source":"orchid_extraction"},"type":"used_in_assessment"}]}