{"cite_as":{"also_cite":["the papers themselves when you use their data (doi / citation of each bibliography record)"],"bibtex":"@misc{orchid_bibliography_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID-Bibliography: papers and typed citation relations}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736021},\n  url       = {https://doi.org/10.5281/zenodo.23736021},\n  note      = {Version 1, machine-extracted}\n}","dataset":"bibliography","doi":"10.5281/zenodo.23736021","licence_note":"Crossref bibliographic metadata: CC0; ORCHID-derived fields (roles, evidence counts, relations): CC BY 4.0","license":"CC-BY-4.0","part_of":{"bibtex":"@misc{orchid_data_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID data: umbrella record of the ORCHID datasets}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736065},\n  url       = {https://doi.org/10.5281/zenodo.23736065},\n  note      = {Version 1, machine-extracted}\n}","doi":"10.5281/zenodo.23736065","text":"R. Arróyave, J. Saal, D. Shin, ORCHID data: umbrella record of the ORCHID datasets (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736065","title":"ORCHID data: umbrella record of the ORCHID datasets","url":"https://doi.org/10.5281/zenodo.23736065"},"release_tag":"v2026.10","status":"Version 1, machine-extracted: roles and evidence counts derive from machine-extracted literature values and link tables; bibliographic fields are Crossref metadata as deposited (DOIs matched from printed references checked against Crossref: doi_match; mismatches dropped).","text":"R. Arróyave, J. Saal, D. Shin, ORCHID-Bibliography: papers and typed citation relations (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736021","title":"ORCHID-Bibliography: papers and typed citation relations","url":"https://doi.org/10.5281/zenodo.23736021","version":"2026.10"},"licence":"Crossref bibliographic metadata: CC0. ORCHID-derived fields (roles, evidence, relations): CC BY 4.0.","paper":{"aliases":[],"article_number":null,"authors":[{"family":"Lee","given":"Tae-Kyu"},{"family":"Bieler","given":"Thomas R."},{"family":"Kim","given":"Choong-Un"},{"family":"Ma","given":"Hongtao"}],"availability":{"open_access_license":null,"pdf_redistributed":false,"read_by_orchid":"no","read_detail":[]},"candidate_systems_inferred":{"AG-BI-SN":"single_seed_closure","AG-CU-PB":"single_seed_closure","AG-SB-SN":"single_seed_closure"},"citation":"Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma, Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys, Fundamentals of Lead-Free Solder Interconnect Technology (2014) 51-80, https://doi.org/10.1007/978-1-4614-9266-5_3","citation_printed":null,"container_title":"Fundamentals of Lead-Free Solder Interconnect Technology","container_title_short":null,"crossref":{"references_count":48,"references_deposited":48,"retrieved_at":"2026-10-23T14:01:51Z","status":"found"},"doi":"10.1007/978-1-4614-9266-5_3","doi_check":null,"doi_match":null,"doi_url":"https://doi.org/10.1007/978-1-4614-9266-5_3","evidence_summary":{},"id":"doi:10.1007/978-1-4614-9266-5_3","id_basis":"doi","is_referenced_by_count":1,"is_referenced_by_count_retrieved":"2026-10-23","isbn":["9781461492658","9781461492665"],"issn":[],"issue":null,"issued":"2014-09-22","key":"p272f31eee60d4b69","language":"en","license":[{"content_version":"tdm","delay_in_days":0,"start":"2014-09-22","url":"https://www.springernature.com/gp/researchers/text-and-data-mining"},{"content_version":"vor","delay_in_days":0,"start":"2014-09-22","url":"https://www.springernature.com/gp/researchers/text-and-data-mining"}],"metadata_source":"crossref","no_doi":false,"pages":"51-80","provenance":["open-tdb@9578e36367ce:catalog/discovery/higher-order-assessment-targets.json"],"publisher":"Springer US","relation_counts":{"cited_by_crossref":{"in":0,"out":16}},"role_details":{"discovery_lead":{"candidate_systems_inferred":{"AG-BI-SN":"single_seed_closure","AG-CU-PB":"single_seed_closure","AG-SB-SN":"single_seed_closure"},"crossref_confirmed_seed_count":5,"discovery_sources":["crossref","openalex","opencitations","semanticscholar"],"is_seed":false,"license_review":"needs_license_review","max_order":3,"rank":2649,"score":66,"snapshot":"open-tdb@9578e36367ce:catalog/discovery/higher-order-assessment-targets.json","systems_named_in_title":["AG-CU-SN"]}},"roles":["discovery_lead"],"subtitle":null,"systems":["AG-CU-SN"],"title":"Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys","type":"book-chapter","urls":{"html":"https://data.orchid-project.org/bibliography/pages/papers/p272f31eee60d4b69.html","json":"https://data.orchid-project.org/bibliography/papers/p272f31eee60d4b69.json"},"volume":null,"year":2014},"relations":[{"count":null,"direction":"out","edge_id":"ee7d45ce084a1ce38","other":{"doi":"10.1007/bf02653344","id":"doi:10.1007/bf02653344","key":"p10e15858fcaebaca","title":"A viable tin-lead solder substitute: Sn-Ag-Cu","year":1994},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ecd9ba0d9e50070af","other":{"doi":"10.1007/bf02653345","id":"doi:10.1007/bf02653345","key":"p9feab970307ca6df","title":"On the Sn-Bi-Ag ternary phase diagram","year":1994},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ed361f174f6d9ea05","other":{"doi":"10.1007/s11661-000-0111-5","id":"doi:10.1007/s11661-000-0111-5","key":"p51aad1f013e36e7e","title":"Tin-silver-copper eutectic temperature and composition","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e64924abd0cb1d9d2","other":{"doi":"10.1007/s11664-000-0003-x","id":"doi:10.1007/s11664-000-0003-x","key":"p90f4b1a94a57d93b","title":"Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ec7dac6e11fcc1467","other":{"doi":"10.1007/s11664-000-0004-9","id":"doi:10.1007/s11664-000-0004-9","key":"p6a3bea75ff2278f2","title":"Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ec6046cdddac757bf","other":{"doi":"10.1007/s11664-003-0026-1","id":"doi:10.1007/s11664-003-0026-1","key":"p7560b8bc3ff20ec0","title":"Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys","year":2003},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e7ec4fcf5a81b90af","other":{"doi":"10.1007/s11664-003-0117-z","id":"doi:10.1007/s11664-003-0117-z","key":"p22a70957c540e32a","title":"Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy","year":2003},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e87877c74873ce12f","other":{"doi":"10.1007/s11664-007-0093-9","id":"doi:10.1007/s11664-007-0093-9","key":"p6a014fcfa8215de3","title":"Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ede2a6eef09b9d6bd","other":{"doi":"10.1007/s11664-007-0247-9","id":"doi:10.1007/s11664-007-0247-9","key":"p968aa809a37a7922","title":"Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e0acaadfba639dffa","other":{"doi":"10.1016/0925-8388(95)02191-4","id":"doi:10.1016/0925-8388(95)02191-4","key":"pd6ffef4b3bc610d5","title":"A thermodynamic study on the AgSbSn system","year":1996},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e43a17bcb89fa8cbf","other":{"doi":"10.1016/s1359-6454(01)00187-2","id":"doi:10.1016/s1359-6454(01)00187-2","key":"p269526a3810e06a8","title":"Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints","year":2001},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e09e30d5800b4c488","other":{"doi":"10.1109/tepm.2003.813003","id":"doi:10.1109/tepm.2003.813003","key":"p6de197278963bf64","title":"Phase equilibria and thermodynamic properties of Sn-Ag based Pb-free solder alloys","year":2003},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e584b25c428ef901f","other":{"doi":"10.1515/ijmr-1986-771108","id":"doi:10.1515/ijmr-1986-771108","key":"pd0dcdd350c46cbfc","title":"A Thermodynamic Optimisation of the Cu-Ag-Pb System","year":1986},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e77e1f96d95802100","other":{"doi":"10.1515/ijmr-1996-870310","id":"doi:10.1515/ijmr-1996-870310","key":"p26b6de8fb6637303","title":"Thermodynamic Assessment of the Cu-Sn System","year":1996},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e51c50d0a74e44e3b","other":{"doi":"10.1557/jmr.2002.0402","id":"doi:10.1557/jmr.2002.0402","key":"pd6c4d0000e4c836e","title":"Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys","year":2002},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e2f0753f6b1b8d178","other":{"doi":"10.2320/matertrans.45.380","id":"doi:10.2320/matertrans.45.380","key":"p2b8c74ecbb75d745","title":"Thermodynamic Study of the Phase Equilibria in the Sn-Ag-Bi-Cu Quaternary System","year":2004},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"}]}