{"cite_as":{"also_cite":["the papers themselves when you use their data (doi / citation of each bibliography record)"],"bibtex":"@misc{orchid_bibliography_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID-Bibliography: papers and typed citation relations}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736021},\n  url       = {https://doi.org/10.5281/zenodo.23736021},\n  note      = {Version 1, machine-extracted}\n}","dataset":"bibliography","doi":"10.5281/zenodo.23736021","licence_note":"Crossref bibliographic metadata: CC0; ORCHID-derived fields (roles, evidence counts, relations): CC BY 4.0","license":"CC-BY-4.0","part_of":{"bibtex":"@misc{orchid_data_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID data: umbrella record of the ORCHID datasets}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736065},\n  url       = {https://doi.org/10.5281/zenodo.23736065},\n  note      = {Version 1, machine-extracted}\n}","doi":"10.5281/zenodo.23736065","text":"R. Arróyave, J. Saal, D. Shin, ORCHID data: umbrella record of the ORCHID datasets (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736065","title":"ORCHID data: umbrella record of the ORCHID datasets","url":"https://doi.org/10.5281/zenodo.23736065"},"release_tag":"v2026.10","status":"Version 1, machine-extracted: roles and evidence counts derive from machine-extracted literature values and link tables; bibliographic fields are Crossref metadata as deposited (DOIs matched from printed references checked against Crossref: doi_match; mismatches dropped).","text":"R. Arróyave, J. Saal, D. Shin, ORCHID-Bibliography: papers and typed citation relations (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736021","title":"ORCHID-Bibliography: papers and typed citation relations","url":"https://doi.org/10.5281/zenodo.23736021","version":"2026.10"},"licence":"Crossref bibliographic metadata: CC0. ORCHID-derived fields (roles, evidence, relations): CC BY 4.0.","paper":{"aliases":["doi:10.1007/s11664-000-0003-x"],"article_number":null,"authors":[{"family":"Moon","given":"K. -W."},{"family":"Boettinger","given":"W. J."},{"family":"Kattner","given":"U. R."},{"family":"Biancaniello","given":"F. S."},{"family":"Handwerker","given":"C. A."}],"availability":{"open_access_license":null,"pdf_redistributed":false,"read_by_orchid":"yes","read_detail":["values_extracted"]},"candidate_systems_inferred":{"AG-BI-SN":"single_seed_closure","AG-CU-PB":"single_seed_closure","AG-SB-SN":"single_seed_closure"},"citation":"K. -W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello, C. A. Handwerker, Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys, Journal of Electronic Materials 29(10) (2000) 1122-1136, https://doi.org/10.1007/s11664-000-0003-x","citation_printed":null,"container_title":"Journal of Electronic Materials","container_title_short":"Journal of Elec Materi","crossref":{"references_count":24,"references_deposited":24,"retrieved_at":"2026-10-23T14:08:07Z","status":"found"},"doi":"10.1007/s11664-000-0003-x","doi_check":{"basis":"tdb_header","evidence":{"author":"other","journal":"match","title":"unknown","volume_page":"match","year":"ok"},"issues":["first_author_not_first_in_crossref"],"sources_checked":["tdb_header"],"status":"verified"},"doi_match":"verified","doi_url":"https://doi.org/10.1007/s11664-000-0003-x","evidence_summary":{"phase_registry_phases":["phase:ag-cu:bcc-a2","phase:ag-cu:fcc-a1","phase:ag-cu:hcp-a3","phase:ag-cu:liquid","phase:ag-sn:a4-diamond","phase:ag-sn:a5-bct","phase:ag-sn:ag3sn-d0a","phase:ag-sn:bcc-a2","phase:ag-sn:fcc-a1","phase:ag-sn:hcp-a3","phase:ag-sn:liquid"],"reader_agreement":{"by_reader_agreement":{"multi_reader":76,"single_reader":7,"single_reader_text_layer":1},"by_reader_tier":{"confirmed_pro":75,"preliminary_flash":8,"preliminary_flash+claude":1}},"reported":{"by_evidence_class":{"experimental":80,"model":4},"by_property":{"INVARIANT_TEMPERATURE":5,"OTHER":1,"PHASE_COMPOSITION":1,"TRANSITION_TEMPERATURE":77},"by_property_group":{"invariant reaction":5,"other property":1,"phase equilibrium":1,"phase transition":77},"n_figures":0,"n_tables":3,"n_text_passages":8,"n_values":84,"n_values_accepted":54}},"id":"doi:10.1007/s11664-000-0003-x","id_basis":"doi","is_referenced_by_count":540,"is_referenced_by_count_retrieved":"2026-10-23","isbn":[],"issn":["0361-5235","1543-186X"],"issue":"10","issued":"2000-10","key":"p90f4b1a94a57d93b","language":"en","license":[{"content_version":"tdm","delay_in_days":0,"start":"2000-10-01","url":"http://www.springer.com/tdm"}],"metadata_source":"crossref","no_doi":false,"pages":"1122-1136","provenance":["open-tdb/build/sgte-corpus/tdb_pdf_links.json","open-tdb@9578e36367ce:catalog/discovery/higher-order-assessment-targets.json","orchid-data/literature/papers.json"],"publisher":"Springer Science and Business Media LLC","relation_counts":{"cited_by_crossref":{"in":51,"out":6},"cites":{"in":0,"out":2},"models_system_in_tdb":{"in":0,"out":2},"reassesses":{"in":1,"out":3},"used_in_assessment":{"in":2,"out":0}},"role_details":{"corpus_assessment_read":{"basis":"orchid-data/literature (reporting paper)","in_census":true,"values_released":84},"discovery_lead":{"candidate_systems_inferred":{"AG-BI-SN":"single_seed_closure","AG-CU-PB":"single_seed_closure","AG-SB-SN":"single_seed_closure"},"crossref_confirmed_seed_count":6,"discovery_sources":["crossref","openalex","opencitations","semanticscholar"],"is_seed":true,"license_review":"needs_license_review","max_order":3,"rank":117,"score":120,"snapshot":"open-tdb@9578e36367ce:catalog/discovery/higher-order-assessment-targets.json","systems_named_in_title":["AG-CU-SN"]},"tdb_source_assessment":{"tdb_files":[{"basis":"sgte_tdb_header_citation","bundled":true,"file":"AgCu-00Moo.tdb","link_match":"volume_page","link_status":"linked_pdf_local","path":"databases/sgte-binary/AgCu-00Moo.tdb","sha256":"1e55749c7312290300c9c5fa7b53b7cc4b6751f5e4be8d499617455a722fa46d","system":"AG-CU"},{"basis":"sgte_tdb_header_citation","bundled":true,"file":"AgSn-00Moo.tdb","link_match":"volume_page","link_status":"linked_pdf_local","path":"databases/sgte-binary/AgSn-00Moo.tdb","sha256":"e65edfd51922f8d792a508c0a477cb818246acdee5320cf083cf3b0a58a3acb8","system":"AG-SN"}]}},"roles":["corpus_assessment_read","tdb_source_assessment","discovery_lead"],"subtitle":null,"systems":["AG-CU","AG-SN","CU-SN","AG-CU-SN"],"title":"Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys","type":"journal-article","urls":{"html":"https://data.orchid-project.org/bibliography/pages/papers/p90f4b1a94a57d93b.html","json":"https://data.orchid-project.org/bibliography/papers/p90f4b1a94a57d93b.json"},"volume":"29","year":2000},"relations":[{"count":null,"direction":"in","edge_id":"e64924abd0cb1d9d2","other":{"doi":"10.1007/978-1-4614-9266-5_3","id":"doi:10.1007/978-1-4614-9266-5_3","key":"p272f31eee60d4b69","title":"Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys","year":2014},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ebcc2825ac5c92675","other":{"doi":"10.1007/978-3-540-47000-7_37","id":"doi:10.1007/978-3-540-47000-7_37","key":"p7a5ac7270a219f58","title":"Cu-Sb-Sn (Copper-Antimony-Tin)","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ecc8b96abd1f9a41d","other":{"doi":"10.1007/978-3-540-47004-5_29","id":"doi:10.1007/978-3-540-47004-5_29","key":"pc5d6166df5e52055","title":"Cu-Ni-Sn (Copper-Nickel– Tin)","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e40cab50fa829d220","other":{"doi":"10.1007/978-3-540-47004-5_35","id":"doi:10.1007/978-3-540-47004-5_35","key":"p2176a9b033f76ce5","title":"Cu-Sn-Ti (Copper-Tin-Titanium)","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e4aa3483bd9878873","other":{"doi":"10.1007/978-3-540-47004-5_9","id":"doi:10.1007/978-3-540-47004-5_9","key":"p71880bd2b883184f","title":"Ag-Cu-Sn (Silver-Copper-Tin)","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ee4c066988fa28e18","other":{"doi":"10.1007/s00706-005-0378-8","id":"doi:10.1007/s00706-005-0378-8","key":"pbb208d4aa8167424","title":"Experimental and Theoretical Study of the Surface Tension in Liquid Ag–Cu–Sn Alloys","year":2005},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e67b514ccccd0a10c","other":{"doi":"10.1007/s00706-005-0392-x","id":"doi:10.1007/s00706-005-0392-x","key":"p4b9b48f60413be02","title":"Thermodynamic Assessment of the Sn–Ti System","year":2005},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ed7e05b9d05c7687e","other":{"doi":"10.1007/s10853-018-1999-8","id":"doi:10.1007/s10853-018-1999-8","key":"pa640ac955695f63c","title":"Thermodynamic assessment of Ag–Cu–In","year":2018},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e4cb35f606bd873c5","other":{"doi":"10.1007/s11661-002-0187-1","id":"doi:10.1007/s11661-002-0187-1","key":"pfd674034262c4162","title":"On differential thermal analyzer curves for the melting and freezing of alloys","year":2002},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e1d082ab530bfc072","other":{"doi":"10.1007/s11664-003-0026-1","id":"doi:10.1007/s11664-003-0026-1","key":"p7560b8bc3ff20ec0","title":"Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys","year":2003},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e155edde8cce42e80","other":{"doi":"10.1007/s11664-003-0117-z","id":"doi:10.1007/s11664-003-0117-z","key":"p22a70957c540e32a","title":"Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy","year":2003},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e9b9effa0c32ae73c","other":{"doi":"10.1007/s11664-006-0029-9","id":"doi:10.1007/s11664-006-0029-9","key":"p327e572191355e05","title":"Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"edd539111aed1a6d0","other":{"doi":"10.1007/s11664-007-0247-9","id":"doi:10.1007/s11664-007-0247-9","key":"p968aa809a37a7922","title":"Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e4d928b2d7a69a625","other":{"doi":"10.1007/s11664-009-1070-2","id":"doi:10.1007/s11664-009-1070-2","key":"p71a3faef2d2c4c3a","title":"Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy","year":2010},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"edbd3784621904d82","other":{"doi":"10.1007/s11664-011-1757-z","id":"doi:10.1007/s11664-011-1757-z","key":"p6a75bce90141756d","title":"Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System","year":2011},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ea64ad4bd843aba89","other":{"doi":"10.1007/s11664-014-3551-1","id":"doi:10.1007/s11664-014-3551-1","key":"p6087cb02cf85ba7b","title":"Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys","year":2015},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e59ecf2ce7fff3d35","other":{"doi":"10.1007/s11669-015-0406-2","id":"doi:10.1007/s11669-015-0406-2","key":"p91d8670b1adb5fad","title":"Experimental Determination of Phase Equilibria in the Ag-Cu-Sb Ternary System","year":2015},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e13d81fefd88c7cb0","other":{"doi":"10.1007/s11669-018-0681-9","id":"doi:10.1007/s11669-018-0681-9","key":"pefc44fda1f31f111","title":"Phase Equilibria in the Cu-Sn-Sb Ternary System","year":2018},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e63bfb0767589ab97","other":{"doi":"10.1007/s11669-022-00953-w","id":"doi:10.1007/s11669-022-00953-w","key":"p6099e533a24bb071","title":"Thermodynamic Modeling of the Co-Cu-Sn Ternary System","year":2022},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e40e6f1404c5eff91","other":{"doi":"10.1007/s11669-024-01112-z","id":"doi:10.1007/s11669-024-01112-z","key":"p86a873d6f16bb963","title":"Thermodynamic Reassessment of the Binary Cu-Sn, Cu-P, and Sn-P and Ternary Cu-Sn-P Systems","year":2024},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e08127494990ec94d","other":{"doi":"10.1007/s11837-004-0068-8","id":"doi:10.1007/s11837-004-0068-8","key":"p88b8c7524fb8ca6c","title":"Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic","year":2004},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ee0434f57fb04ff17","other":{"doi":"10.1016/j.calphad.2010.12.006","id":"doi:10.1016/j.calphad.2010.12.006","key":"p343d0cd2e8839d68","title":"Experimental investigation and thermodynamic assessment of the Cu–Sn–Ti ternary system","year":2011},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e2de85cc1d9871f6f","other":{"doi":"10.1016/j.calphad.2019.01.001","id":"doi:10.1016/j.calphad.2019.01.001","key":"pfde17ef20139f080","title":"Experimental study and thermodynamic modelling of the Ag-Cd-In system","year":2019},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"efa44899a1b50528b","other":{"doi":"10.1016/j.calphad.2021.102344","id":"doi:10.1016/j.calphad.2021.102344","key":"pe50fb40851484dc0","title":"Thermodynamic descriptions of the binary Ni–Sn and ternary Cu–Ni–Sn systems over entire composition range: A revisit","year":2021},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e3415e9ce320d93ec","other":{"doi":"10.1016/j.calphad.2025.102833","id":"doi:10.1016/j.calphad.2025.102833","key":"pb96979e34e3e2f5a","title":"The SGTE collection of binary datasets","year":2025},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ecf7809a7537d1ec7","other":{"doi":"10.1016/j.intermet.2007.10.002","id":"doi:10.1016/j.intermet.2007.10.002","key":"pa8b1aa8939cf7ac2","title":"Phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints at 400°C and 150°C","year":2008},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"eadd82f57d1555a78","other":{"doi":"10.1016/j.intermet.2012.10.010","id":"doi:10.1016/j.intermet.2012.10.010","key":"p50b6d1cd18da52a8","title":"The Cu–Sn phase diagram part II: New thermodynamic assessment","year":2013},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ed800e044543605f1","other":{"doi":"10.1016/j.jallcom.2012.06.138","id":"doi:10.1016/j.jallcom.2012.06.138","key":"p2e3862c3b4d4f06b","title":"Ab initio comparative study of the Cu–In and Cu–Sn intermetallic phases in Cu–In–Sn alloys","year":2012},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"eae76b69d2ee31a63","other":{"doi":"10.1016/j.jallcom.2015.10.104","id":"doi:10.1016/j.jallcom.2015.10.104","key":"p01b3a1fe3460e30d","title":"Solidification paths in the iron-rich part of the Fe–Ti–B ternary system","year":2016},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ee18501f33062f031","other":{"doi":"10.1016/j.jallcom.2016.08.035","id":"doi:10.1016/j.jallcom.2016.08.035","key":"pda17608147b5e16a","title":"Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems","year":2016},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e437732044c74844c","other":{"doi":"10.1016/j.jallcom.2026.187281","id":"doi:10.1016/j.jallcom.2026.187281","key":"pb8e4ee8b16a9875b","title":"The experimental phase equilibria studies of the Cu-Sn-S system","year":2026},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e27f12ce7920cdc0a","other":{"doi":"10.1016/j.jnoncrysol.2022.121444","id":"doi:10.1016/j.jnoncrysol.2022.121444","key":"pe7993ed6f7b48679","title":"Application of surface tension in the design of novel Sn-Ag-Cu-based solders","year":2022},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e1c3286acae7dee66","other":{"doi":"10.1016/j.matchemphys.2026.132209","id":"doi:10.1016/j.matchemphys.2026.132209","key":"p56eb50f27200d6e3","title":"Ag–Cu–Sb liquidus projection and invariant reactions","year":2026},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e521b915b1e85a74f","other":{"doi":"10.1080/13640461.2017.1379261","id":"doi:10.1080/13640461.2017.1379261","key":"p4d676f7fcbdd1630","title":"Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys","year":2017},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e97824a3ce20e72c2","other":{"doi":"10.1109/icept.2007.4441439","id":"doi:10.1109/icept.2007.4441439","key":"p06e2798971c998bd","title":"Thermodynamic Calculation of Phase Equilibria and Its Applications in the Sn-Ag-Cu-Ni-Au System","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"eee96539547abc184","other":{"doi":"10.1557/jmr.2002.0402","id":"doi:10.1557/jmr.2002.0402","key":"pd6c4d0000e4c836e","title":"Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys","year":2002},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e55a3b87aa4bfe466","other":{"doi":"10.1557/jmr.2004.0296","id":"doi:10.1557/jmr.2004.0296","key":"pe386568aa399bb42","title":"Phase equilibria of the Ag–Sn–Cu ternary system","year":2004},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e60a1cc57656d5a8e","other":{"doi":"10.3139/146.101499","id":"doi:10.3139/146.101499","key":"p4d3c28b54bd583bb","title":"Bismuth activity measurements and thermodynamic re-optimization of the Ni–Bi System","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e6c48e82821efcd8d","other":{"doi":"10.3139/146.110472","id":"doi:10.3139/146.110472","key":"p29228ef3dec99d73","title":"Thermodynamic modelling of the Ag–Cu–Ti ternary system","year":2011},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e096d6c235f4ca460","other":{"doi":"10.3139/146.110887","id":"doi:10.3139/146.110887","key":"p3c5d16180510e914","title":"Phase diagram investigation of the Sn-In<i>\n                     <sub>x</sub>\n                  </i>Ag<i>\n                     <sub>y</sub>\n                  </i>Cu<i>\n                     <sub>z</sub>\n                  </i> (<i>x:y:z</i> = 7:2:1) section in the Ag-In-Sn-Cu system","year":2013},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ef996065431d7b3d0","other":{"doi":"10.3390/met12101557","id":"doi:10.3390/met12101557","key":"p20d4a437887bcd4c","title":"Thermodynamic Modeling of the Ag-Cu-Sn Ternary System","year":2022},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e48eb85ee1a2f0e9d","other":{"doi":"10.70675/be124174z6c6cz4075zba40zc2d376d094d7","id":"doi:10.70675/be124174z6c6cz4075zba40zc2d376d094d7","key":"pd31eb64d601c721b","title":"Experimental contribution to thermodynamics of the Ag-Cd-In, In-Zr and In2O3-ZrO2 systems","year":2026},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e6085c51cb8123d4b","other":{"doi":"10.70675/f4a5f1f0z47a9z4364zbc6dzcb1a36f2c75d","id":"doi:10.70675/f4a5f1f0z47a9z4364zbc6dzcb1a36f2c75d","key":"pbc59293321d93895","title":"Contribution à l'étude thermodynamique du système ternaire Fe-Ti-B du côté riche en Fe","year":2026},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e7fab5f1979922426","other":{"doi":"10.7121/msi-eureka-10.11399.1.3","id":"doi:10.7121/msi-eureka-10.11399.1.3","key":"p6fc53a7697a4d257","title":"Cu-Ni-Sn Ternary Phase Diagram Evaluation","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e3c36e2f584481fa6","other":{"doi":"10.7121/msi-eureka-10.11399.2.2","id":"doi:10.7121/msi-eureka-10.11399.2.2","key":"p906d67f87a541cc5","title":"Cu-Ni-Sn Ternary Phase Diagram Evaluation","year":2013},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e3449d09db8a2600e","other":{"doi":"10.7121/msi-eureka-10.11452.1.0","id":"doi:10.7121/msi-eureka-10.11452.1.0","key":"p2b5176df70d450c3","title":"Cu-Sb-Sn Ternary Phase Diagram Evaluation","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ed01bc24d1f21fcaf","other":{"doi":"10.7121/msi-eureka-10.16022.2.5","id":"doi:10.7121/msi-eureka-10.16022.2.5","key":"pe04576ec85754e55","title":"Ag-Cu-Sn Ternary Phase Diagram Evaluation","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"edc57818999b89e1d","other":{"doi":"10.7121/msi-eureka-10.16022.3.9","id":"doi:10.7121/msi-eureka-10.16022.3.9","key":"p6e0db72bfd9f8e32","title":"Ag-Cu-Sn Ternary Phase Diagram Evaluation","year":2021},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e81703526b20725be","other":{"doi":"10.7121/msi-eureka-10.16549.2.8","id":"doi:10.7121/msi-eureka-10.16549.2.8","key":"p26dc3fa39bc9d52e","title":"Ag-Cu-Fe Ternary Phase Diagram Evaluation","year":2006},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"eaa91ff9bae34e68c","other":{"doi":"10.7121/msi-eureka-10.16549.3.7","id":"doi:10.7121/msi-eureka-10.16549.3.7","key":"p20f4c8860f72eb94","title":"Ag-Cu-Fe Ternary Phase Diagram Evaluation","year":2018},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"e91eb7194c31f7a71","other":{"doi":"10.7121/msi-eureka-10.19550.1.8","id":"doi:10.7121/msi-eureka-10.19550.1.8","key":"p835a6030547852d4","title":"Cu-Sn-Ti Ternary Phase Diagram Evaluation","year":2007},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"edbc70e531d98ad47","other":{"doi":"10.1007/bf02653344","id":"doi:10.1007/bf02653344","key":"p10e15858fcaebaca","title":"A viable tin-lead solder substitute: Sn-Ag-Cu","year":1994},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e5d72c193bbc7b964","other":{"doi":"10.1007/bf02653345","id":"doi:10.1007/bf02653345","key":"p9feab970307ca6df","title":"On the Sn-Bi-Ag ternary phase diagram","year":1994},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ebd0cf7026e5a9bb7","other":{"doi":"10.1007/s11661-000-0111-5","id":"doi:10.1007/s11661-000-0111-5","key":"p51aad1f013e36e7e","title":"Tin-silver-copper eutectic temperature and composition","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e0ef7628f1975b3a6","other":{"doi":"10.1016/0040-6031(88)87426-4","id":"doi:10.1016/0040-6031(88)87426-4","key":"p415a39c580ac75dc","title":"A thermodynamic evaluation of the Ag-Sn system","year":1988},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e7db0d9478c505404","other":{"doi":"10.1016/0364-5916(91)90030-n","id":"doi:10.1016/0364-5916(91)90030-n","key":"p227ede60b45e6e38","title":"SGTE data for pure elements","year":1991},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ed892db5e0ebd68d3","other":{"doi":"10.1016/0925-8388(95)02191-4","id":"doi:10.1016/0925-8388(95)02191-4","key":"pd6ffef4b3bc610d5","title":"A thermodynamic study on the AgSbSn system","year":1996},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"attrs":{"citation_status":{"resolved":1},"evidence_class":{"experimental":1},"n_values":1,"n_values_accepted":0,"property":{"INVARIANT_TEMPERATURE":1},"systems":["AG-CU"]},"count":1,"direction":"out","edge_id":"e068f134db3c0f33f","other":{"doi":"10.1007/bf02653344","id":"doi:10.1007/bf02653344","key":"p10e15858fcaebaca","title":"A viable tin-lead solder substitute: Sn-Ag-Cu","year":1994},"provenance":{"dataset":"orchid-data/literature/orchid-literature.jsonl.gz","method":"record.cited_sources (reference printed for the value in the containing paper)","source":"orchid_extraction"},"type":"cites"},{"attrs":{"citation_status":{"resolved":6},"evidence_class":{"experimental":6},"n_values":6,"n_values_accepted":6,"property":{"TRANSITION_TEMPERATURE":6},"systems":["AG-CU-SN"]},"count":6,"direction":"out","edge_id":"eb8bbef50537afcfa","other":{"doi":"10.1007/s11661-000-0111-5","id":"doi:10.1007/s11661-000-0111-5","key":"p51aad1f013e36e7e","title":"Tin-silver-copper eutectic temperature and composition","year":2000},"provenance":{"dataset":"orchid-data/literature/orchid-literature.jsonl.gz","method":"record.cited_sources (reference printed for the value in the containing paper)","source":"orchid_extraction"},"type":"cites"},{"attrs":{"link_status":"linked_pdf_local","system":"AG-CU","tdb_sha256":"1e55749c7312290300c9c5fa7b53b7cc4b6751f5e4be8d499617455a722fa46d"},"count":null,"direction":"out","edge_id":"ea2e8514cb91df273","other":{"id":"tdb:AgCu-00Moo.tdb","kind":"tdb_file"},"provenance":{"dataset":"open-tdb/build/sgte-corpus/tdb_pdf_links.json","method":"TDB header citation matched to the Hallstedt 2025 reference list (linked_pdf_local, volume_page)","source":"sgte_tdb_header"},"type":"models_system_in_tdb"},{"attrs":{"link_status":"linked_pdf_local","system":"AG-SN","tdb_sha256":"e65edfd51922f8d792a508c0a477cb818246acdee5320cf083cf3b0a58a3acb8"},"count":null,"direction":"out","edge_id":"e6b330d31b453a763","other":{"id":"tdb:AgSn-00Moo.tdb","kind":"tdb_file"},"provenance":{"dataset":"open-tdb/build/sgte-corpus/tdb_pdf_links.json","method":"TDB header citation matched to the Hallstedt 2025 reference list (linked_pdf_local, volume_page)","source":"sgte_tdb_header"},"type":"models_system_in_tdb"},{"attrs":{"systems":["AG-SN"],"year_dst":2000,"year_src":2011},"count":null,"direction":"in","edge_id":"ee4d9ab65d97e0721","other":{"doi":"10.1007/s11664-011-1757-z","id":"doi:10.1007/s11664-011-1757-z","key":"p6a75bce90141756d","title":"Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System","year":2011},"provenance":{"citation_basis":["crossref_reference_list"],"dataset":"edges cites / cited_by_crossref + TDB systems","method":"citation+same-system","source":"citation+same-system"},"type":"reassesses"},{"attrs":{"systems":["AG-SN"],"year_dst":1994,"year_src":2000},"count":null,"direction":"out","edge_id":"e79a222fbd82e08bb","other":{"doi":"10.1007/bf02653345","id":"doi:10.1007/bf02653345","key":"p9feab970307ca6df","title":"On the Sn-Bi-Ag ternary phase diagram","year":1994},"provenance":{"citation_basis":["crossref_reference_list"],"dataset":"edges cites / cited_by_crossref + TDB systems","method":"citation+same-system","source":"citation+same-system"},"type":"reassesses"},{"attrs":{"systems":["AG-SN"],"year_dst":1988,"year_src":2000},"count":null,"direction":"out","edge_id":"e7ae6f511b8c4bc34","other":{"doi":"10.1016/0040-6031(88)87426-4","id":"doi:10.1016/0040-6031(88)87426-4","key":"p415a39c580ac75dc","title":"A thermodynamic evaluation of the Ag-Sn system","year":1988},"provenance":{"citation_basis":["crossref_reference_list"],"dataset":"edges cites / cited_by_crossref + TDB systems","method":"citation+same-system","source":"citation+same-system"},"type":"reassesses"},{"attrs":{"systems":["AG-SN"],"year_dst":1996,"year_src":2000},"count":null,"direction":"out","edge_id":"ee76b92083df0c5df","other":{"doi":"10.1016/0925-8388(95)02191-4","id":"doi:10.1016/0925-8388(95)02191-4","key":"pd6ffef4b3bc610d5","title":"A thermodynamic study on the AgSbSn system","year":1996},"provenance":{"citation_basis":["crossref_reference_list"],"dataset":"edges cites / cited_by_crossref + TDB systems","method":"citation+same-system","source":"citation+same-system"},"type":"reassesses"},{"attrs":{"citation_status":{"resolved":1},"evidence_class":{"experimental":1},"n_values":1,"n_values_accepted":0,"property":{"INVARIANT_TEMPERATURE":1},"systems":["AG-CU"]},"count":1,"direction":"in","edge_id":"e4917565a12d9f6d4","other":{"doi":"10.1007/bf02653344","id":"doi:10.1007/bf02653344","key":"p10e15858fcaebaca","title":"A viable tin-lead solder substitute: Sn-Ag-Cu","year":1994},"provenance":{"dataset":"orchid-data/literature/orchid-literature.jsonl.gz","method":"record.cited_sources (reference printed for the value in the containing paper)","source":"orchid_extraction"},"type":"used_in_assessment"},{"attrs":{"citation_status":{"resolved":6},"evidence_class":{"experimental":6},"n_values":6,"n_values_accepted":6,"property":{"TRANSITION_TEMPERATURE":6},"systems":["AG-CU-SN"]},"count":6,"direction":"in","edge_id":"eea4c1db26aae34c0","other":{"doi":"10.1007/s11661-000-0111-5","id":"doi:10.1007/s11661-000-0111-5","key":"p51aad1f013e36e7e","title":"Tin-silver-copper eutectic temperature and composition","year":2000},"provenance":{"dataset":"orchid-data/literature/orchid-literature.jsonl.gz","method":"record.cited_sources (reference printed for the value in the containing paper)","source":"orchid_extraction"},"type":"used_in_assessment"}]}