{"cite_as":{"also_cite":["the papers themselves when you use their data (doi / citation of each bibliography record)"],"bibtex":"@misc{orchid_bibliography_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID-Bibliography: papers and typed citation relations}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736021},\n  url       = {https://doi.org/10.5281/zenodo.23736021},\n  note      = {Version 1, machine-extracted}\n}","dataset":"bibliography","doi":"10.5281/zenodo.23736021","licence_note":"Crossref bibliographic metadata: CC0; ORCHID-derived fields (roles, evidence counts, relations): CC BY 4.0","license":"CC-BY-4.0","part_of":{"bibtex":"@misc{orchid_data_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID data: umbrella record of the ORCHID datasets}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736065},\n  url       = {https://doi.org/10.5281/zenodo.23736065},\n  note      = {Version 1, machine-extracted}\n}","doi":"10.5281/zenodo.23736065","text":"R. Arróyave, J. Saal, D. Shin, ORCHID data: umbrella record of the ORCHID datasets (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736065","title":"ORCHID data: umbrella record of the ORCHID datasets","url":"https://doi.org/10.5281/zenodo.23736065"},"release_tag":"v2026.10","status":"Version 1, machine-extracted: roles and evidence counts derive from machine-extracted literature values and link tables; bibliographic fields are Crossref metadata as deposited (DOIs matched from printed references checked against Crossref: doi_match; mismatches dropped).","text":"R. Arróyave, J. Saal, D. Shin, ORCHID-Bibliography: papers and typed citation relations (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736021","title":"ORCHID-Bibliography: papers and typed citation relations","url":"https://doi.org/10.5281/zenodo.23736021","version":"2026.10"},"licence":"Crossref bibliographic metadata: CC0. ORCHID-derived fields (roles, evidence, relations): CC BY 4.0.","paper":{"aliases":[],"article_number":null,"authors":[{"family":"Henderson","given":"Donald W."},{"family":"Gosselin","given":"Timothy"},{"family":"Sarkhel","given":"Amit"},{"family":"Kang","given":"Sung K."},{"family":"Choi","given":"Won-Kyoung"},{"family":"Shih","given":"Da-Yuan"},{"family":"Goldsmith","given":"Charles"},{"family":"Puttlitz","given":"Karl J."}],"availability":{"open_access_license":null,"pdf_redistributed":false,"read_by_orchid":"no","read_detail":[]},"candidate_systems_inferred":{"AG-CU-PB":"single_seed_closure","AG-SB-SN":"single_seed_closure"},"citation":"Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Sung K. Kang, Won-Kyoung Choi, Da-Yuan Shih et al., Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys, Journal of Materials Research 17(11) (2002) 2775-2778, https://doi.org/10.1557/jmr.2002.0402","citation_printed":null,"container_title":"Journal of Materials Research","container_title_short":"J. Mater. Res.","crossref":{"references_count":12,"references_deposited":12,"retrieved_at":"2026-10-23T14:29:39Z","status":"found"},"doi":"10.1557/jmr.2002.0402","doi_check":null,"doi_match":null,"doi_url":"https://doi.org/10.1557/jmr.2002.0402","evidence_summary":{},"id":"doi:10.1557/jmr.2002.0402","id_basis":"doi","is_referenced_by_count":176,"is_referenced_by_count_retrieved":"2026-10-23","isbn":[],"issn":["0884-2914","2044-5326"],"issue":"11","issued":"2002-11","key":"pd6c4d0000e4c836e","language":"en","license":[{"content_version":"unspecified","delay_in_days":3013,"start":"2011-01-31","url":"https://www.cambridge.org/core/terms"}],"metadata_source":"crossref","no_doi":false,"pages":"2775-2778","provenance":["open-tdb@9578e36367ce:catalog/discovery/higher-order-assessment-targets.json"],"publisher":"Springer Science and Business Media LLC","relation_counts":{"cited_by_crossref":{"in":3,"out":5}},"role_details":{"discovery_lead":{"candidate_systems_inferred":{"AG-CU-PB":"single_seed_closure","AG-SB-SN":"single_seed_closure"},"crossref_confirmed_seed_count":4,"discovery_sources":["crossref","openalex","opencitations","semanticscholar"],"is_seed":false,"license_review":"needs_license_review","max_order":3,"rank":922,"score":97,"snapshot":"open-tdb@9578e36367ce:catalog/discovery/higher-order-assessment-targets.json","systems_named_in_title":["AG-CU-SN"]}},"roles":["discovery_lead"],"subtitle":null,"systems":["AG-CU-SN"],"title":"Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys","type":"journal-article","urls":{"html":"https://data.orchid-project.org/bibliography/pages/papers/pd6c4d0000e4c836e.html","json":"https://data.orchid-project.org/bibliography/papers/pd6c4d0000e4c836e.json"},"volume":"17","year":2002},"relations":[{"count":null,"direction":"in","edge_id":"e51c50d0a74e44e3b","other":{"doi":"10.1007/978-1-4614-9266-5_3","id":"doi:10.1007/978-1-4614-9266-5_3","key":"p272f31eee60d4b69","title":"Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys","year":2014},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ea8e054c36a3e1925","other":{"doi":"10.1007/s11664-003-0026-1","id":"doi:10.1007/s11664-003-0026-1","key":"p7560b8bc3ff20ec0","title":"Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys","year":2003},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"in","edge_id":"ecd853bdb8983ae14","other":{"doi":"10.1007/s11837-004-0068-8","id":"doi:10.1007/s11837-004-0068-8","key":"p88b8c7524fb8ca6c","title":"Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic","year":2004},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e25a91c496c6ebb9e","other":{"doi":"10.1007/s11661-000-0111-5","id":"doi:10.1007/s11661-000-0111-5","key":"p51aad1f013e36e7e","title":"Tin-silver-copper eutectic temperature and composition","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"eee96539547abc184","other":{"doi":"10.1007/s11664-000-0003-x","id":"doi:10.1007/s11664-000-0003-x","key":"p90f4b1a94a57d93b","title":"Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e3f4f1134eea0c34e","other":{"doi":"10.1007/s11664-000-0004-9","id":"doi:10.1007/s11664-000-0004-9","key":"p6a3bea75ff2278f2","title":"Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys","year":2000},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"e41a38de44232bcf5","other":{"doi":"10.1016/0364-5916(85)90021-5","id":"doi:10.1016/0364-5916(85)90021-5","key":"pb92c09fb74e0090d","title":"The Thermo-Calc databank system","year":1985},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"},{"count":null,"direction":"out","edge_id":"ed45a95acc6f86f52","other":{"doi":"10.1016/0925-8388(95)02191-4","id":"doi:10.1016/0925-8388(95)02191-4","key":"pd6ffef4b3bc610d5","title":"A thermodynamic study on the AgSbSn system","year":1996},"provenance":{"source":"crossref_reference_list"},"type":"cited_by_crossref"}]}