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Shin, ORCHID-Bibliography: papers and typed citation relations (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736021","title":"ORCHID-Bibliography: papers and typed citation relations","url":"https://doi.org/10.5281/zenodo.23736021","version":"2026.10"},"elements":["AG","CU"],"papers":[{"doi":"10.1007/bf02653344","id":"doi:10.1007/bf02653344","key":"p10e15858fcaebaca","title":"A viable tin-lead solder substitute: Sn-Ag-Cu","year":1994},{"doi":"10.1007/s11664-000-0003-x","id":"doi:10.1007/s11664-000-0003-x","key":"p90f4b1a94a57d93b","title":"Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys","year":2000},{"doi":"10.1016/0022-5088(88)90272-x","id":"doi:10.1016/0022-5088(88)90272-x","key":"p85947c17cda95c0c","title":"Thermodynamic and kinetic aspects of crystallization of supercooled AgCu liquids","year":1988},{"doi":"10.1016/j.calphad.2006.09.001","id":"doi:10.1016/j.calphad.2006.09.001","key":"p4c28fe6fbe7513e7","title":"Thermodynamic description of the Cu–Ag–Zr system","year":2006},{"doi":"10.1016/j.jallcom.2004.04.126","id":"doi:10.1016/j.jallcom.2004.04.126","key":"p4893dbcb01335354","title":"The Ag–Al–Cu system","year":2004},{"doi":"10.1515/ijmr-1986-771108","id":"doi:10.1515/ijmr-1986-771108","key":"pd0dcdd350c46cbfc","title":"A Thermodynamic Optimisation of the Cu-Ag-Pb System","year":1986},{"doi":null,"id":"nodoi:744fb6f6ec0e4e0c","key":"pea20231c8a745c03","title":"H.L. 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