{"assessments":[{"data_papers_used":[{"doi":"10.1108/eb037896","evidence_class":{"experimental":1},"id":"doi:10.1108/eb037896","key":"p01b47cd87c87cf2e","n_values":1,"n_values_accepted":0,"title":"Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste","year":1995}],"doi":"10.1007/s11664-998-0205-1","id":"doi:10.1007/s11664-998-0205-1","key":"pcd8de0738f8721b9","n_data_papers_used":1,"n_values_from_cited_papers":1,"reassesses":[],"tdb_files":[],"title":"Thermodynamics of the Sn-In-Ag solder system","values_reported":10,"year":1998}],"cite_as":{"also_cite":["the papers themselves when you use their data (doi / citation of each bibliography record)"],"bibtex":"@misc{orchid_bibliography_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID-Bibliography: papers and typed citation relations}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736021},\n  url       = {https://doi.org/10.5281/zenodo.23736021},\n  note      = {Version 1, machine-extracted}\n}","dataset":"bibliography","doi":"10.5281/zenodo.23736021","licence_note":"Crossref bibliographic metadata: CC0; ORCHID-derived fields (roles, evidence counts, relations): CC BY 4.0","license":"CC-BY-4.0","part_of":{"bibtex":"@misc{orchid_data_2026,\n  author    = {Arr{\\'o}yave, Raymundo and Saal, James and Shin, Dongwon},\n  title     = {{ORCHID data: umbrella record of the ORCHID datasets}},\n  version   = {2026.10},\n  publisher = {Zenodo},\n  year      = {2026},\n  doi       = {10.5281/zenodo.23736065},\n  url       = {https://doi.org/10.5281/zenodo.23736065},\n  note      = {Version 1, machine-extracted}\n}","doi":"10.5281/zenodo.23736065","text":"R. Arróyave, J. Saal, D. Shin, ORCHID data: umbrella record of the ORCHID datasets (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736065","title":"ORCHID data: umbrella record of the ORCHID datasets","url":"https://doi.org/10.5281/zenodo.23736065"},"release_tag":"v2026.10","status":"Version 1, machine-extracted: roles and evidence counts derive from machine-extracted literature values and link tables; bibliographic fields are Crossref metadata as deposited (DOIs matched from printed references checked against Crossref: doi_match; mismatches dropped).","text":"R. Arróyave, J. Saal, D. Shin, ORCHID-Bibliography: papers and typed citation relations (version 2026.10; Version 1, machine-extracted), Zenodo (2026). https://doi.org/10.5281/zenodo.23736021","title":"ORCHID-Bibliography: papers and typed citation relations","url":"https://doi.org/10.5281/zenodo.23736021","version":"2026.10"},"elements":["AG","IN","SN"],"papers":[{"doi":"10.1007/978-3-540-47004-5_13","id":"doi:10.1007/978-3-540-47004-5_13","key":"pd4aee8be536294db","title":"Ag-In-Sn (Silver-Indium-Tin)","year":2007},{"doi":"10.1007/s10973-005-7443-8","id":"doi:10.1007/s10973-005-7443-8","key":"p64918d9348c4b286","title":"Comparative thermodynamic study and characterization of ternary Ag-In-Sn alloys","year":2007},{"doi":"10.1007/s11664-002-0003-0","id":"doi:10.1007/s11664-002-0003-0","key":"p7206dc5c19320dc2","title":"Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system","year":2002},{"doi":"10.1007/s11664-998-0205-1","id":"doi:10.1007/s11664-998-0205-1","key":"pcd8de0738f8721b9","title":"Thermodynamics of the Sn-In-Ag solder system","year":1998},{"doi":"10.1016/j.ijms.2007.12.008","id":"doi:10.1016/j.ijms.2007.12.008","key":"pde74f61f50d6d7c5","title":"Knudsen effusion mass spectrometric determination of mixing thermodynamic data of liquid Ag–In–Sn alloy","year":2008},{"doi":"10.1016/j.jallcom.2005.03.011","id":"doi:10.1016/j.jallcom.2005.03.011","key":"p7a7030b4712d84e3","title":"Experimental study of the Ag–Sn–In phase diagram","year":2005},{"doi":"10.1016/j.jallcom.2019.03.016","id":"doi:10.1016/j.jallcom.2019.03.016","key":"p450aabf9579d06e9","title":"Thermodynamic study of the Ag-In-Sn system by the EMF method","year":2019},{"doi":"10.1016/j.matchemphys.2011.02.078","id":"doi:10.1016/j.matchemphys.2011.02.078","key":"p43b28ab32049c06a","title":"Sn–In–Ag phase equilibria and Sn–In–(Ag)/Ag interfacial reactions","year":2011},{"doi":"10.1108/eb037896","id":"doi:10.1108/eb037896","key":"p01b47cd87c87cf2e","title":"Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste","year":1995},{"doi":"10.2298/hemind0803148m","id":"doi:10.2298/hemind0803148m","key":"pc64a70a3c3a5b519","title":"Phase equilibria investigation and alloys characterization in Sn-In-Ag system","year":2008},{"doi":"10.2320/matertrans.42.732","id":"doi:10.2320/matertrans.42.732","key":"p027ace7cd6f92ddc","title":"Activity Measurement of the Constituents in Molten Ag-In-Sn Ternary Alloy by Mass Spectrometry","year":2001},{"doi":"10.7121/msi-eureka-10.14858.2.0","id":"doi:10.7121/msi-eureka-10.14858.2.0","key":"p3ac9f088ca44e112","title":"Ag-In-Sn Ternary Phase Diagram Evaluation","year":2007},{"doi":"10.7121/msi-eureka-10.14858.3.4","id":"doi:10.7121/msi-eureka-10.14858.3.4","key":"pab8910916196ce1b","title":"Ag-In-Sn Ternary Phase Diagram Evaluation","year":2021}],"papers_by_role":{"cited_original_source":["doi:10.1108/eb037896"],"corpus_assessment_read":["doi:10.1007/s11664-998-0205-1"],"discovery_lead":["doi:10.1007/978-3-540-47004-5_13","doi:10.1007/s10973-005-7443-8","doi:10.1007/s11664-002-0003-0","doi:10.1007/s11664-998-0205-1","doi:10.1016/j.ijms.2007.12.008","doi:10.1016/j.jallcom.2005.03.011","doi:10.1016/j.jallcom.2019.03.016","doi:10.1016/j.matchemphys.2011.02.078","doi:10.2298/hemind0803148m","doi:10.2320/matertrans.42.732","doi:10.7121/msi-eureka-10.14858.2.0","doi:10.7121/msi-eureka-10.14858.3.4"],"tdb_source_assessment":["doi:10.1007/s11664-998-0205-1"]},"system":"AG-IN-SN"}