Cu5Nd: enthalpy of formation

2 accepted literature formation-enthalpy value(s) (model 1, DFT 1); Materials Project -15.243 kJ/mol-atom (mp-aaaaabrw); OQMD -15.768 kJ/mol-atom (oqmd-31351).

Systems: Cu–Nd

Literature values

Enthalpy of formation of Cu5Nd reported in the literature (2)
ValuePhase as printedT (K)ClassMethodSystemSourceLocationQuote
-15.704 kJ/mol-atomCu5Nd298.15modelCALPHADCu–Nd[1] Wang 2011Table 2, p. 3, row 5
report
-15.846 kJ/mol-atomCu5Nd298.15DFTDFTCu–Nd[1] Wang 2011Table 2, p. 3, row 4
report

Uncertainty budget

Components kept separate, in the value's unit (literature SCHEMA.md, UNCERTAINTY_CALIBRATION.md): effective = max(sqrt(max(printed, reading, method)^2 + composition^2 + conversion^2), scatter). The method floor is the robust between-study scatter of the method class in ORCHID (calibrated) or a documented prior; printed values and printed uncertainties are unchanged.

Uncertainty budget of the literature values of Cu5Nd
ValueUnitPrintedReadingMethod (class, basis)CompositionScatterConversionEffective
-15.704kJ/mol-atom5.000e-43.9 (model_calculated, calibrated)3.9
-15.846kJ/mol-atom5.000e-48.395 (dft, calibrated)8.395

DFT formation energies

Lowest-energy entries at this composition. Materials Project and OQMD use different energy references and are never averaged. 1 eV/atom = 96.485 kJ/mol-atom.

DFT formation energy of Cu5Nd
SourceEntrykJ/mol-atomeV/atomSpace groupE above hull (kJ/mol-atom)E above hull (eV/atom)Theoretical
Materials Projectmp-aaaaabrw-15.243-0.157985P6/mmm00no
OQMDoqmd-31351-15.768-0.163426P6/mmm00no

DFT sources: A. Jain et al., Commentary: The Materials Project: A materials genome approach to accelerating materials innovation, APL Materials 1 (2013) 011002. doi:10.1063/1.4812323 (CC BY 4.0); J. E. Saal et al., JOM 65 (2013) 1501-1509; S. Kirklin et al., npj Comput. Mater. 1 (2015) 15010. doi:10.1007/s11837-013-0755-4 (CC BY 4.0);

Sources

  1. Peisheng Wang, Liangcai Zhou, Yong Du, Honghui Xu, Shuhong Liu, Li Chen et al., Thermodynamic optimization of the Cu–Nd system, Journal of Alloys and Compounds 509, 2679-2683 (2011). doi:10.1016/j.jallcom.2010.11.160