Cu6Sn5: enthalpy of formation

4 accepted literature formation-enthalpy value(s) (experimental 2, model 2); experimental median -6.566 kJ/mol-atom (n = 2); Materials Project -1.267 kJ/mol-atom (mp-aaaaabvl); OQMD -5.877 kJ/mol-atom (oqmd-18303).

Systems: Cu–Sn

Literature values

Enthalpy of formation of Cu6Sn5 reported in the literature (4)
ValuePhase as printedT (K)ClassMethodSystemSourceLocationQuote
-7.033 kJ/mol-atomη′ (Cu6Sn5_L)273experimentalCu–Sn[1] Li 2013
cites Gangulee 1973 doi
Table 3, p. 8, row 11
report
-6.1 kJ/mol-atomη (Cu6Sn5_H)298.15experimentalCu–Sn[1] Li 2013
cites Flandorfer 2007 doi
Table 3, p. 8, row 13
report
-7.13 kJ/mol-atomη' (Cu6Sn5_L)273modelCu–Sn[1] Li 2013Table 3, p. 8, row 12
report
-6.6 kJ/mol-atomη (Cu6Sn5_H)298.15modelCu–Sn[1] Li 2013Table 3, p. 8, row 14
report

Uncertainty budget

Components kept separate, in the value's unit (literature SCHEMA.md, UNCERTAINTY_CALIBRATION.md): effective = max(sqrt(max(printed, reading, method)^2 + composition^2 + conversion^2), scatter). The method floor is the robust between-study scatter of the method class in ORCHID (calibrated) or a documented prior; printed values and printed uncertainties are unchanged.

Uncertainty budget of the literature values of Cu6Sn5
ValueUnitPrintedReadingMethod (class, basis)CompositionScatterConversionEffective
-7.033kJ/mol-atom5.000e-43.5 (unknown, calibrated)3.5
-6.1kJ/mol-atom5.000e-43.5 (unknown, calibrated)3.5
-7.13kJ/mol-atom5.000e-53.9 (model_calculated, calibrated)3.9
-6.6kJ/mol-atom5.000e-43.9 (model_calculated, calibrated)3.9

DFT formation energies

Lowest-energy entries at this composition. Materials Project and OQMD use different energy references and are never averaged. 1 eV/atom = 96.485 kJ/mol-atom.

DFT formation energy of Cu6Sn5
SourceEntrykJ/mol-atomeV/atomSpace groupE above hull (kJ/mol-atom)E above hull (eV/atom)Theoretical
Materials Projectmp-aaaaabvl-1.267-0.013134C2/c0.77750.0081no
OQMDoqmd-18303-5.877-0.060906C2/c0.49770.0052no

DFT sources: A. Jain et al., Commentary: The Materials Project: A materials genome approach to accelerating materials innovation, APL Materials 1 (2013) 011002. doi:10.1063/1.4812323 (CC BY 4.0); J. E. Saal et al., JOM 65 (2013) 1501-1509; S. Kirklin et al., npj Comput. Mater. 1 (2015) 15010. doi:10.1007/s11837-013-0755-4 (CC BY 4.0);

Sources

  1. D. Li, P. Franke, S. Fürtauer, D. Cupid, H. Flandorfer, The Cu–Sn phase diagram part II: New thermodynamic assessment, Intermetallics 34, 148-158 (2013). doi:10.1016/j.intermet.2012.10.010