Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System
Przemyslaw Fima, Grzegorz Garzel, Anna Sypień
Journal of Electronic Materials 43 (12) 4365-4373 (2014) · Springer Science and Business Media LLC
DOI: 10.1007/s11664-014-3304-1
Data: JSON record · id doi:10.1007/s11664-014-3304-1 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 1339, score 83; systems named in title: Ag–Bi–Cu
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): http://creativecommons.org/licenses/by/4.0 (unspecified). Crossref is-referenced-by count: 6 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (3)
- On the Sn-Bi-Ag ternary phase diagram (1994) [crossref_reference_list]
- Thermal analysis and microstructure of the as-cast Ag–Bi–Cu alloys (2014) [crossref_reference_list]
- Thermodynamic Study of the Phase Equilibria in the Sn-Ag-Bi-Cu Quaternary System (2004) [crossref_reference_list]