Cu-Sn-Ti (Copper-Tin-Titanium)
Materials Science International Team MSIT®
Landolt-Börnstein - Group IV Physical Chemistry 409-421 (2007) · Springer Berlin Heidelberg
DOI: 10.1007/978-3-540-47004-5_35
Data: JSON record · id doi:10.1007/978-3-540-47004-5_35 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 2709, score 43; systems named in title: Cu–Sn–Ti
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 0 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (2)
- Thermodynamic Assessment of the Sn–Ti System (2005) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]