Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

K. -W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello, C. A. Handwerker

Journal of Electronic Materials 29 (10) 1122-1136 (2000) · Springer Science and Business Media LLC

DOI: 10.1007/s11664-000-0003-x

Data: JSON record · id doi:10.1007/s11664-000-0003-x · metadata: crossref

Roles in ORCHID

Systems

Ag–Cu, Ag–Sn, Cu–Sn, Ag–Cu–Sn

Evidence in ORCHID

84 values read from this paper (54 accepted), from 3 tables and 8 text passages.

By evidence class
experimental80
model4
By property group
phase transition77
invariant reaction5
other property1
phase equilibrium1

Phase-registry phases citing it: phase:ag-cu:bcc-a2, phase:ag-cu:fcc-a1, phase:ag-cu:hcp-a3, phase:ag-cu:liquid, phase:ag-sn:a4-diamond, phase:ag-sn:a5-bct, phase:ag-sn:ag3sn-d0a, phase:ag-sn:bcc-a2, phase:ag-sn:fcc-a1, phase:ag-sn:hcp-a3, phase:ag-sn:liquid

Availability

Read by ORCHID: yes (values_extracted). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 540 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (51)

References (Crossref, publisher-deposited) (6)

Cites (values carry this citation) (2)

TDB files modelling its system (2)

Reassessed by (1)

Reassesses (cites an earlier assessment of the same system) (3)

Data papers used (2)