Cu-Ni-Sn Ternary Phase Diagram Evaluation

Gautam Ghosh

MSI Eureka 37 10.11399.1.3 (2007) · Materials Science International Services GmBH

DOI: 10.7121/msi-eureka-10.11399.1.3

Data: JSON record · id doi:10.7121/msi-eureka-10.11399.1.3 · metadata: crossref

Roles in ORCHID

• discovery lead (found by Crossref assessment discovery, not read): rank 424, score 111; systems named in title: Cu–Ni–Sn

Systems

Cu–Ni–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 0 (retrieved 2026-10-23).

Relations

References (Crossref, publisher-deposited) (10)

• The Ni−Sn (Nickel-Tin) system (1985) [crossref_reference_list]
• The Cu-Sn (Copper-Tin) system (1990) [crossref_reference_list]
• Experimental investigation and thermodynamic calculation of the phase equilibria in the Cu-Sn and Cu-Sn-Mn systems (2004) [crossref_reference_list]
• Thermodynamic modeling of the nickel-lead-tin system (1999) [crossref_reference_list]
• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
• Thermodynamic description of the Cu–Ni–Sn system at the Cu–Ni side (2003) [crossref_reference_list]
• Thermodynamic optimization of the Ni–Sn binary system (2004) [crossref_reference_list]
• Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints (2001) [crossref_reference_list]
• Thermodynamic Assessment of the Cu-Sn System (1996) [crossref_reference_list]
• Ternary Diffusion and Thermodynamic Interactions in α Cu–Ni–Sn Solid Solutions (1986) [crossref_reference_list]