Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints

G. Ghosh

Acta Materialia 49 (14) 2609-2624 (2001) · Elsevier BV

DOI: 10.1016/s1359-6454(01)00187-2

Data: JSON record · id doi:10.1016/s1359-6454(01)00187-2 · metadata: crossref

Roles in ORCHID

Systems

Cu–Si

Evidence in ORCHID

1 values in 1 other papers cite this work as their source.

Cited values by evidence class
unspecified1

Phase-registry phases citing it: phase:cu-si:a4-diamond, phase:cu-si:cu3si-lt, phase:cu-si:cu3si-mt

Availability

Read by ORCHID: no (full_text_screened_for_origin). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 162 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (8)

References (Crossref, publisher-deposited) (1)

Cited for values by (1)

Used in (assessments / papers that took values from it) (1)