Cu-Ni-Sn (Copper-Nickel– Tin)

Materials Science International Team MSIT®

Landolt-Börnstein - Group IV Physical Chemistry 303-337 (2007) · Springer Berlin Heidelberg

DOI: 10.1007/978-3-540-47004-5_29

Data: JSON record · id doi:10.1007/978-3-540-47004-5_29 · metadata: crossref

Roles in ORCHID

• discovery lead (found by Crossref assessment discovery, not read): rank 2715, score 42; systems named in title: Cu–Ni–Sn

Systems

Cu–Ni–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 0 (retrieved 2026-10-23).

Relations

References (Crossref, publisher-deposited) (5)

• The Cu-Sn (Copper-Tin) system (1990) [crossref_reference_list]
• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
• Thermodynamic optimization of the Ni–Sn binary system (2004) [crossref_reference_list]
• Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints (2001) [crossref_reference_list]
• Ternary Diffusion and Thermodynamic Interactions in α Cu–Ni–Sn Solid Solutions (1986) [crossref_reference_list]