Ternary Diffusion and Thermodynamic Interactions in α Cu–Ni–Sn Solid Solutions

Tomoshi Takahashi, Michitomo Katoh, Yoritoshi Minamino, Toshimi Yamane

Transactions of the Japan Institute of Metals 27 (12) 949-959 (1986) · Japan Institute of Metals

DOI: 10.2320/matertrans1960.27.949

Data: JSON record · id doi:10.2320/matertrans1960.27.949 · metadata: crossref

Roles in ORCHID

• cited as the original source of values

Systems

Ni–Sn

Evidence in ORCHID

1 values in 1 other papers cite this work as their source.

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 6 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (5)

• Cu-Ni-Sn (Copper-Nickel– Tin) (2007) [crossref_reference_list]
• Thermodynamic description of the Cu–Ni–Sn system at the Cu–Ni side (2003) [crossref_reference_list]
• Cu-Ni-Sn Ternary Phase Diagram Evaluation (2007) [crossref_reference_list]
• Cu-Ni-Sn Ternary Phase Diagram Evaluation (2013) [crossref_reference_list]
• Cu-Ni-Sn Ternary Phase Diagram Evaluation (2022) [crossref_reference_list]

Cited for values by (1)

• Thermodynamic description of the Cu–Ni–Sn system at the Cu–Ni side (2003) — 1 values [orchid_extraction]

Used in (assessments / papers that took values from it) (1)

• Thermodynamic description of the Cu–Ni–Sn system at the Cu–Ni side (2003) — 1 values [orchid_extraction]