Cu-Ni-Sn Ternary Phase Diagram Evaluation
Gautam Ghosh, Jingrui Zhao
MSI Eureka 91 10.11399.3.1 (2022) · Materials Science International Services GmBH
DOI: 10.7121/msi-eureka-10.11399.3.1
Data: JSON record · id doi:10.7121/msi-eureka-10.11399.3.1 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 2803, score -3; systems named in title: Cu–Ni–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 1 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (7)
- Thermodynamic description of the Cu–Ni–Sn system at the Cu–Ni side (2003) [crossref_reference_list]
- A new investigation of the system Ni–Sn (2007) [crossref_reference_list]
- Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints (2001) [crossref_reference_list]
- Ternary Diffusion and Thermodynamic Interactions in α Cu–Ni–Sn Solid Solutions (1986) [crossref_reference_list]
- Structural Properties of Co3Sn2, Ni3Sn2 and Some Ternary Derivatives. (1986) [crossref_reference_list]
- Cu-Ni-Sn Ternary Phase Diagram Evaluation (2013) [crossref_reference_list]
- Al-Fe-V Ternary Phase Diagram Evaluation (2023) [crossref_reference_list]