Cu-Ni-Sn Ternary Phase Diagram Evaluation
Gautam Ghosh
MSI Eureka 55 10.11399.2.2 (2013) · Materials Science International Services GmBH
DOI: 10.7121/msi-eureka-10.11399.2.2
Data: JSON record · id doi:10.7121/msi-eureka-10.11399.2.2 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 2673, score 61; systems named in title: Cu–Ni–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 2 (retrieved 2026-10-23).
Relations
Cited by (Crossref reference lists) (1)
- Cu-Ni-Sn Ternary Phase Diagram Evaluation (2022) [crossref_reference_list]
References (Crossref, publisher-deposited) (11)
- The Ni−Sn (Nickel-Tin) system (1985) [crossref_reference_list]
- The Cu-Sn (Copper-Tin) system (1990) [crossref_reference_list]
- Experimental investigation and thermodynamic calculation of the phase equilibria in the Cu-Sn and Cu-Sn-Mn systems (2004) [crossref_reference_list]
- Thermodynamic modeling of the nickel-lead-tin system (1999) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Thermodynamic description of the Cu–Ni–Sn system at the Cu–Ni side (2003) [crossref_reference_list]
- Thermodynamic optimization of the Ni–Sn binary system (2004) [crossref_reference_list]
- Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints (2001) [crossref_reference_list]
- Thermodynamic Assessment of the Cu-Sn System (1996) [crossref_reference_list]
- Ternary Diffusion and Thermodynamic Interactions in α Cu–Ni–Sn Solid Solutions (1986) [crossref_reference_list]
- Al-Fe-V Ternary Phase Diagram Evaluation (2023) [crossref_reference_list]