Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys

Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

Fundamentals of Lead-Free Solder Interconnect Technology 51-80 (2014) · Springer US

DOI: 10.1007/978-1-4614-9266-5_3

Data: JSON record · id doi:10.1007/978-1-4614-9266-5_3 · metadata: crossref

Roles in ORCHID

Systems

Ag–Cu–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 1 (retrieved 2026-10-23).

Relations

References (Crossref, publisher-deposited) (16)