A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack F. Smith

Journal of Electronic Materials 23 (7) 595-601 (1994) · Springer Science and Business Media LLC

DOI: 10.1007/bf02653344

Data: JSON record · id doi:10.1007/bf02653344 · metadata: crossref

Roles in ORCHID

Systems

Ag–Cu

Evidence in ORCHID

1 values in 1 other papers cite this work as their source.

Cited values by evidence class
experimental1

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 251 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (15)

References (Crossref, publisher-deposited) (1)

Cited for values by (1)

Used in (assessments / papers that took values from it) (1)