Tin-silver-copper eutectic temperature and composition
M. E. Loomans, M. E. Fine
Metallurgical and Materials Transactions A 31 (4) 1155-1162 (2000) · Springer Science and Business Media LLC
DOI: 10.1007/s11661-000-0111-5
Data: JSON record · id doi:10.1007/s11661-000-0111-5 · metadata: crossref
Roles in ORCHID
- cited as the original source of values
Systems
Evidence in ORCHID
6 values in 1 other papers cite this work as their source.
| experimental | 6 |
Availability
Read by ORCHID: no (full_text_screened_for_origin). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 155 (retrieved 2026-10-23).
Relations
Cited by (Crossref reference lists) (14)
- Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys (2014) [crossref_reference_list]
- Ag-Cu-Sn (Silver-Copper-Tin) (2007) [crossref_reference_list]
- Calorimetric studies of Ag–Sn–Cu dental amalgam alloy powders and their amalgams (2017) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys (2003) [crossref_reference_list]
- Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System (2007) [crossref_reference_list]
- Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy (2010) [crossref_reference_list]
- Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System (2011) [crossref_reference_list]
- Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic (2004) [crossref_reference_list]
- Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems (2016) [crossref_reference_list]
- Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys (2002) [crossref_reference_list]
- Thermodynamic Modeling of the Ag-Cu-Sn Ternary System (2022) [crossref_reference_list]
- Ag-Cu-Sn Ternary Phase Diagram Evaluation (2007) [crossref_reference_list]
- Ag-Cu-Sn Ternary Phase Diagram Evaluation (2021) [crossref_reference_list]
References (Crossref, publisher-deposited) (1)
- A viable tin-lead solder substitute: Sn-Ag-Cu (1994) [crossref_reference_list]
Cited for values by (1)
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) — 6 values [orchid_extraction]
Used in (assessments / papers that took values from it) (1)
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) — 6 values [orchid_extraction]