Ag–Cu–Sn: papers in ORCHID
Data: JSON · all systems
Assessments and the data papers they used
| Assessment | Year | TDB | Data papers used | Values from them | Reassesses |
|---|---|---|---|---|---|
| Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys | 2000 | 1 | 6 | ||
| Thermodynamic study of the phase equilibria in the Sn−Ti−Zn ternary system | 2006 | 0 | 0 |
cited as the original source of values (1)
read by ORCHID (values extracted) (2)
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000)
- Thermodynamic study of the phase equilibria in the Sn−Ti−Zn ternary system (2006)
discovery lead (found by Crossref assessment discovery, not read) (18)
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000)
- Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys (2000)
- Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys (2002)
- Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys (2003)
- Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic (2004)
- Phase equilibria of the Ag–Sn–Cu ternary system (2004)
- Experimental and Theoretical Study of the Surface Tension in Liquid Ag–Cu–Sn Alloys (2005)
- Thermodynamic study of the phase equilibria in the Sn−Ti−Zn ternary system (2006)
- Ag-Cu-Sn (Silver-Copper-Tin) (2007)
- Ag-Cu-Sn Ternary Phase Diagram Evaluation (2007)
- Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys (2014)
- Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys (2015)
- Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems (2016)
- Calorimetric studies of Ag–Sn–Cu dental amalgam alloy powders and their amalgams (2017)
- Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys (2017)
- Ag-Cu-Sn Ternary Phase Diagram Evaluation (2021)
- Application of surface tension in the design of novel Sn-Ag-Cu-based solders (2022)
- Thermodynamic Modeling of the Ag-Cu-Sn Ternary System (2022)