Application of surface tension in the design of novel Sn-Ag-Cu-based solders

Dexiang Hou, Pengcheng Cai, Jun Luan, Zhigang Yu, Jieyu Zhang, Kuo-Chih Chou

Journal of Non-Crystalline Solids 582 121444 (2022) · Elsevier BV

DOI: 10.1016/j.jnoncrysol.2022.121444

Data: JSON record · id doi:10.1016/j.jnoncrysol.2022.121444 · metadata: crossref

Roles in ORCHID

discovery lead (found by Crossref assessment discovery, not read): rank 466, score 109; systems named in title: Ag–Cu–Sn

Systems

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 5 (retrieved 2026-10-23).

Relations

References (Crossref, publisher-deposited) (10)

A thermodynamic study of the phase equilibria in the Bi-Sn-Sb system (1994) [crossref_reference_list]
On the Sn-Bi-Ag ternary phase diagram (1994) [crossref_reference_list]
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system (2001) [crossref_reference_list]
Studies of the Ag-In phase diagram and surface tension measurements (2001) [crossref_reference_list]
A thermodynamic study on the AgSbSn system (1996) [crossref_reference_list]
Surface tension calculation of the Sn–Ga–In ternary alloy (2007) [crossref_reference_list]
Experimental study and thermodynamic calculation of Bi–Cu–Sb system phase equilibria (2008) [crossref_reference_list]
The Sn-In-Zn system-application of calphad technique to phase diagram measurement (2001) [crossref_reference_list]
Thermodynamic assessment of the Cu-In binary system (2002) [crossref_reference_list]