Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys

I. Ohnuma, M. Miyashita, K. Anzai, X. J. Liu, H. Ohtani, R. Kainuma, K. Ishida

Journal of Electronic Materials 29 (10) 1137-1144 (2000) · Springer Science and Business Media LLC

DOI: 10.1007/s11664-000-0004-9

Data: JSON record · id doi:10.1007/s11664-000-0004-9 · metadata: crossref

Roles in ORCHID

Systems

Ag–Cu–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 125 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (16)

References (Crossref, publisher-deposited) (7)