Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Sung K. Kang, Won-Kyoung Choi, Da-Yuan Shih, Charles Goldsmith, Karl J. Puttlitz
Journal of Materials Research 17 (11) 2775-2778 (2002) · Springer Science and Business Media LLC
Data: JSON record · id doi:10.1557/jmr.2002.0402 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 922, score 97; systems named in title: Ag–Cu–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 176 (retrieved 2026-10-23).
Relations
Cited by (Crossref reference lists) (3)
- Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys (2014) [crossref_reference_list]
- Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys (2003) [crossref_reference_list]
- Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic (2004) [crossref_reference_list]
References (Crossref, publisher-deposited) (5)
- Tin-silver-copper eutectic temperature and composition (2000) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys (2000) [crossref_reference_list]
- The Thermo-Calc databank system (1985) [crossref_reference_list]
- A thermodynamic study on the AgSbSn system (1996) [crossref_reference_list]