Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys

Jae-Yong Park, Choong-Un Kim, Ted Carper, Viswanadham Puligandla

Journal of Electronic Materials 32 (11) 1297-1302 (2003) · Springer Science and Business Media LLC

DOI: 10.1007/s11664-003-0026-1

Data: JSON record · id doi:10.1007/s11664-003-0026-1 · metadata: crossref

Roles in ORCHID

• discovery lead (found by Crossref assessment discovery, not read): rank 2174, score 50; systems named in title: Ag–Cu–Sn

Systems

Ag–Cu–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 19 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (5)

• Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys (2014) [crossref_reference_list]
• Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy (2003) [crossref_reference_list]
• Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples (2007) [crossref_reference_list]
• Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic (2004) [crossref_reference_list]
• Thermodynamic Modeling of the Ag-Cu-Sn Ternary System (2022) [crossref_reference_list]

References (Crossref, publisher-deposited) (5)

• A viable tin-lead solder substitute: Sn-Ag-Cu (1994) [crossref_reference_list]
• Tin-silver-copper eutectic temperature and composition (2000) [crossref_reference_list]
• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
• Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys (2000) [crossref_reference_list]
• Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys (2002) [crossref_reference_list]