Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic
K. -W. Moon, W. J. Boettinger
JOM 56 (4) 22-27 (2004) · Springer Science and Business Media LLC
DOI: 10.1007/s11837-004-0068-8
Data: JSON record · id doi:10.1007/s11837-004-0068-8 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 1157, score 90; systems named in title: Ag–Cu–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 30 (retrieved 2026-10-23).
Relations
Cited by (Crossref reference lists) (3)
- Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys (2017) [crossref_reference_list]
- Ag-Cu-Sn Ternary Phase Diagram Evaluation (2007) [crossref_reference_list]
- Ag-Cu-Sn Ternary Phase Diagram Evaluation (2021) [crossref_reference_list]
References (Crossref, publisher-deposited) (6)
- A viable tin-lead solder substitute: Sn-Ag-Cu (1994) [crossref_reference_list]
- Tin-silver-copper eutectic temperature and composition (2000) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys (2003) [crossref_reference_list]
- A thermodynamic study on the AgSbSn system (1996) [crossref_reference_list]
- Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys (2002) [crossref_reference_list]