Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys
Osvaldo Fornaro (ORCID 0000-0003-1150-8531), Carina Morando
International Journal of Cast Metals Research 31 (2) 118-124 (2017) · Informa UK Limited
DOI: 10.1080/13640461.2017.1379261
Data: JSON record · id doi:10.1080/13640461.2017.1379261 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 2546, score 80; systems named in title: Ag–Cu–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 6 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (4)
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic (2004) [crossref_reference_list]
- SGTE data for pure elements (1991) [crossref_reference_list]
- A thermodynamic study on the AgSbSn system (1996) [crossref_reference_list]