Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

Jir̆í Sopoušek, Marián Palcut, Erika Hodúlová, Jozef Janovec

Journal of Electronic Materials 39 (3) 312-317 (2010) · Springer Science and Business Media LLC

DOI: 10.1007/s11664-009-1070-2

Data: JSON record · id doi:10.1007/s11664-009-1070-2 · metadata: crossref

Roles in ORCHID

Systems

Ag–Cu–In–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 25 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (1)

References (Crossref, publisher-deposited) (14)