Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems
Donatella Giuranno, Simona Delsante, Gabriella Borzone, Rada Novakovic
Journal of Alloys and Compounds 689 918-930 (2016) · Elsevier BV
DOI: 10.1016/j.jallcom.2016.08.035
Data: JSON record · id doi:10.1016/j.jallcom.2016.08.035 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 1336, score 83; systems named in title: Ag–Cu–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 67 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (7)
- A viable tin-lead solder substitute: Sn-Ag-Cu (1994) [crossref_reference_list]
- Tin-silver-copper eutectic temperature and composition (2000) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys (2000) [crossref_reference_list]
- A new investigation of the system Ni–Sn (2007) [crossref_reference_list]
- The Cu–Sn phase diagram part II: New thermodynamic assessment (2013) [crossref_reference_list]
- A revision of the Sm-rich region of the Sm–Co system (2010) [crossref_reference_list]