Phase equilibria and thermodynamic properties of Sn-Ag based Pb-free solder alloys

I. Ohnuma, M. Miyashita, Xing Jun Liu, H. Ohtani, K. Ishida

IEEE Transactions on Electronics Packaging Manufacturing 26 (1) 84-89 (2003) · Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/tepm.2003.813003

Data: JSON record · id doi:10.1109/tepm.2003.813003 · metadata: crossref

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