Ag-Cu-Sn (Silver-Copper-Tin)
Materials Science International Team MSIT®
Landolt-Börnstein - Group IV Physical Chemistry 47-62 (2007) · Springer Berlin Heidelberg
DOI: 10.1007/978-3-540-47004-5_9
Data: JSON record · id doi:10.1007/978-3-540-47004-5_9 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 2700, score 45; systems named in title: Ag–Cu–Sn
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 0 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (4)
- Tin-silver-copper eutectic temperature and composition (2000) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Phase equilibria and thermodynamic properties of Sn-Ag based Pb-free solder alloys (2003) [crossref_reference_list]
- Thermodynamic Study of Phase Equilibria in the Sn-Ag-Zn System (1999) [crossref_reference_list]