Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

Kathlene N. Reeve, Iver E. Anderson, Carol A. Handwerker

Journal of Electronic Materials 44 (3) 842-866 (2015) · Springer Science and Business Media LLC

DOI: 10.1007/s11664-014-3551-1

Data: JSON record · id doi:10.1007/s11664-014-3551-1 · metadata: crossref

Roles in ORCHID

• discovery lead (found by Crossref assessment discovery, not read): rank 1337, score 83; systems named in title: Ag–Cu–Sn

Systems

Ag–Cu–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 11 (retrieved 2026-10-23).

Relations

References (Crossref, publisher-deposited) (10)

• A viable tin-lead solder substitute: Sn-Ag-Cu (1994) [crossref_reference_list]
• The Al−Sn (Aluminum-Tin) System (1983) [crossref_reference_list]
• The Ag-Sn (Silver-Tin) system (1987) [crossref_reference_list]
• The Ag−Al (Silver-Aluminum) system (1987) [crossref_reference_list]
• The Cu-Sn (Copper-Tin) system (1990) [crossref_reference_list]
• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
• Re-investigation of phase equilibria in the system Al–Cu and structural analysis of the high-temperature phase η1-Al1−δCu (2011) [crossref_reference_list]
• The Cu–Sn phase diagram part II: New thermodynamic assessment (2013) [crossref_reference_list]
• Phase equilibria in the Cu-rich portion of the Cu–Al binary system (1998) [crossref_reference_list]
• The aluminium-copper system (1985) [crossref_reference_list]