Ag–Cu: papers in ORCHID

Data: JSON · all systems

Assessments and the data papers they used

cited as the original source of values (1)

• A viable tin-lead solder substitute: Sn-Ag-Cu (1994)

read by ORCHID (values extracted) (4)

• Thermodynamic and kinetic aspects of crystallization of supercooled AgCu liquids (1988)
• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000)
• The Ag–Al–Cu system (2004)
• Thermodynamic description of the Cu–Ag–Zr system (2006)

discovery lead (found by Crossref assessment discovery, not read) (2)

• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000)
• Thermodynamic description of the Cu–Ag–Zr system (2006)

original evaluation behind an assessed (handbook) diagram (1)

• P.R. Subramanian and J.H. Perepezko, Phase Diagrams of Binary Copper Alloys, P.R. Subramanian, D.J. Chakrabarti, and D.E. Laughlin, ed., ASM International, Materials Park, Ohio, 5-17 (1994) (1994)

assessment behind a TDB file (6)

• A Thermodynamic Optimisation of the Cu-Ag-Pb System (1986)
• B. Joensson, J. Agren, J. Less-Common Met., 145, 153-66(1988). (1988)
• H.L. Lukas, unpublished, 1998. (1998)
• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000)
• The Ag–Al–Cu system (2004)
• Thermodynamic description of the Cu–Ag–Zr system (2006)