On the binary (Cu + Si) system: Thermodynamic modelling of the phase diagram and atomic mobility in face centred cubic phase

Wojciech Gierlotka, Md. Azizul Haque

The Journal of Chemical Thermodynamics 57 32-38 (2013) · Elsevier BV

DOI: 10.1016/j.jct.2012.07.025

Data: JSON record · id doi:10.1016/j.jct.2012.07.025 · metadata: crossref

Roles in ORCHID

• read by ORCHID (values extracted): 63 released values
• assessment behind a TDB file: CuSi-13Gie.tdb (Cu–Si)

Systems

Cu–Si

Evidence in ORCHID

63 values read from this paper (57 accepted), from 1 tables and 5 text passages.

ESPEI datasets derived: 8 (derived/invariant-brackets/CU-SI/CuSi-13Gie.zpf-00.json …).

Phase-registry phases citing it: phase:cu-si:a4-diamond, phase:cu-si:bcc-a2, phase:cu-si:cu15si4, phase:cu-si:cu33si7, phase:cu-si:cu33si7-a13, phase:cu-si:cu33si7-ht, phase:cu-si:cu3si-ht, phase:cu-si:cu3si-lt, phase:cu-si:cu3si-mt, phase:cu-si:fcc-a1, phase:cu-si:hcp-a3, phase:cu-si:liquid

Availability

Read by ORCHID: yes (values_extracted). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 15 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (6)

• CALPHAD-Type Reassessment of Cu-Si and Full Assessment of the Al-Cu-Si Systems (2024) [crossref_reference_list]
• Calorimetric measurements and assessment of the binary Cu–Si and ternary Al–Cu–Si phase diagrams (2016) [crossref_reference_list]
• The SGTE collection of binary datasets (2025) [crossref_reference_list]
• Phase diagram and thermodynamic model for the Cu-Si and the Cu-Fe-Si systems (2019) [crossref_reference_list]
• Experimental investigation and thermodynamic modeling of Cu–Nb–Si system (2023) [crossref_reference_list]
• Uranium speciation in metallic and oxide liquids for the vitrification of Long-Lived Intermediate-Level waste (2026) [crossref_reference_list]

References (Crossref, publisher-deposited) (4)

• Ab initio lattice stability in comparison with CALPHAD lattice stability (2004) [crossref_reference_list]
• Experimental investigation of the Cu–Si phase diagram at x(Cu)>0.72 (2011) [crossref_reference_list]
• A thermodynamic analysis of the Cu–Si system (2000) [crossref_reference_list]
• Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints (2001) [crossref_reference_list]

Cites (values carry this citation) (2)

• Experimental investigation of the Cu–Si phase diagram at x(Cu)>0.72 (2011) — 14 values [orchid_extraction]
• Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints (2001) — 1 values [orchid_extraction]

TDB files modelling its system (2)

• tdb:CuSi-13Gie.tdb [orchid_literature_model_link]
• tdb:CuSi-13Gie.tdb [sgte_tdb_header]

Reassessed by (3)

• CALPHAD-Type Reassessment of Cu-Si and Full Assessment of the Al-Cu-Si Systems (2024) [citation+same-system]
• Calorimetric measurements and assessment of the binary Cu–Si and ternary Al–Cu–Si phase diagrams (2016) [citation+same-system]
• Phase diagram and thermodynamic model for the Cu-Si and the Cu-Fe-Si systems (2019) [citation+same-system]

Reassesses (cites an earlier assessment of the same system) (1)

• A thermodynamic analysis of the Cu–Si system (2000) [citation+same-system]

Data papers used (2)

• Experimental investigation of the Cu–Si phase diagram at x(Cu)>0.72 (2011) — 14 values [orchid_extraction]
• Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints (2001) — 1 values [orchid_extraction]