Cu-Sn-Ti Ternary Phase Diagram Evaluation
Chunlei Liu, Ulrich Klotz, Jörg Löffler
MSI Eureka 37 10.19550.1.8 (2007) · Materials Science International Services GmBH
DOI: 10.7121/msi-eureka-10.19550.1.8
Data: JSON record · id doi:10.7121/msi-eureka-10.19550.1.8 · metadata: crossref
Roles in ORCHID
- discovery lead (found by Crossref assessment discovery, not read): rank 552, score 108; systems named in title: Cu–Sn–Ti
Systems
Availability
Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 0 (retrieved 2026-10-23).
Relations
References (Crossref, publisher-deposited) (5)
- Thermodynamic Assessment of the Sn–Ti System (2005) [crossref_reference_list]
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys (2000) [crossref_reference_list]
- Cu-Ti (Copper-Titanium) (2002) [crossref_reference_list]
- Thermodynamic Assessment of the Cu-Sn System (1996) [crossref_reference_list]
- Thermodynamic Optimisation of the Cu-Ti System (1996) [crossref_reference_list]