Prediction of IMC formation during interfacial reactions: Application of CALPHAD approach to electronic package

Huashan Liu, WenJun Zhu, ZhanPeng Jin

2009 International Conference on Electronic Packaging Technology & High Density Packaging 1130-1137 (2009) · IEEE

DOI: 10.1109/icept.2009.5270606

Data: JSON record · id doi:10.1109/icept.2009.5270606 · metadata: crossref

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• discovery lead (found by Crossref assessment discovery, not read): rank 1300, score 84; systems named in title: none

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Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 0 (retrieved 2026-10-23).

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References (Crossref, publisher-deposited) (6)

• Thermodynamic description of the Cu–Ni–Sn system at the Cu–Ni side (2003) [crossref_reference_list]
• A thermodynamic assessment of the Co–Sn system (2004) [crossref_reference_list]
• Thermodynamic optimization of the Ni–Sn binary system (2004) [crossref_reference_list]
• Thermodynamic assessments of the Sn-Zn and In-Zn binary systems (1996) [crossref_reference_list]
• Thermodynamic assessment of the Cu-In binary system (2002) [crossref_reference_list]
• Prediction of formation of intermetallic compounds in diffusion couples (2007) [crossref_reference_list]