Formation enthalpies of various ternary intermetallic compounds in the Cu-Li-Sn system

S. Fürtauer (ORCID 0000-0001-8939-3661), H. Flandorfer

Journal of Alloys and Compounds 781 1110-1118 (2019) · Elsevier BV

DOI: 10.1016/j.jallcom.2018.11.376

Data: JSON record · id doi:10.1016/j.jallcom.2018.11.376 · metadata: crossref

Roles in ORCHID

• discovery lead (found by Crossref assessment discovery, not read): rank 1287, score 85; systems named in title: Cu–Li–Sn

Systems

Cu–Li–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 4 (retrieved 2026-10-23).

Relations

References (Crossref, publisher-deposited) (6)

• The Cu–Sn phase diagram part II: New thermodynamic assessment (2013) [crossref_reference_list]
• The Cu-Li-Sn phase diagram: Isothermal sections (2016) [crossref_reference_list]
• Experimental thermodynamic study of the Cu-Li-Sn system by Knudsen Effusion Mass Spectrometry (2016) [crossref_reference_list]
• Calorimetric studies of Cu–Li, Li–Sn, and Cu–Li–Sn (2013) [crossref_reference_list]
• Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds (2007) [crossref_reference_list]
• Thermodynamic Study of the Lithium‐Tin System (1981) [crossref_reference_list]