Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds

H. Flandorfer, U. Saeed, C. Luef, A. Sabbar, H. Ipser

Thermochimica Acta 459 (1-2) 34-39 (2007) · Elsevier BV

DOI: 10.1016/j.tca.2007.04.004

Data: JSON record · id doi:10.1016/j.tca.2007.04.004 · metadata: crossref

Roles in ORCHID

Systems

Cu–Sn

Evidence in ORCHID

3 values in 1 other papers cite this work as their source.

Cited values by evidence class
experimental3

Phase-registry phases citing it: phase:cu-sn:cu3sn-l

Availability

Read by ORCHID: no (full_text_screened_for_origin). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 85 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (13)

References (Crossref, publisher-deposited) (7)

Cited for values by (1)

Used in (assessments / papers that took values from it) (1)