Calorimetric investigation of the Cu-Sn-Bi lead-free solder system

S. Amore, S. Delsante, N. Parodi, G. Borzone

Journal of Thermal Analysis and Calorimetry 92 (1) 227-232 (2008) · Springer Science and Business Media LLC

DOI: 10.1007/s10973-007-8814-0

Data: JSON record · id doi:10.1007/s10973-007-8814-0 · metadata: crossref

Roles in ORCHID

• discovery lead (found by Crossref assessment discovery, not read): rank 1137, score 91; systems named in title: Bi–Cu–Sn

Systems

Bi–Cu–Sn

Availability

Read by ORCHID: no. Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 5 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (1)

• Sn-Bi-Cu phase equilibria and directionally solidified alloys (2027) [crossref_reference_list]

References (Crossref, publisher-deposited) (8)

• Thermodynamic assessments of the Sn-In and Sn-Bi binary systems (1996) [crossref_reference_list]
• The Bi−Cu (Bismuth-Copper) System (1984) [crossref_reference_list]
• The Cu-Sn (Copper-Tin) system (1990) [crossref_reference_list]
• Comparative thermodynamic study and characterization of ternary Ag-In-Sn alloys (2007) [crossref_reference_list]
• An assessment of the thermodynamic properties and phase diagram of the system Bi-Cu (1990) [crossref_reference_list]
• A thermodynamic evaluation of the Copper — Bismuth and Copper — Lead systems (1986) [crossref_reference_list]
• SGTE data for pure elements (1991) [crossref_reference_list]
• Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds (2007) [crossref_reference_list]