Beiträge zur systematischen Verwandtschaftslehre XXVIII. Über die Bildungswärmen intermetallischer verbindungen V. Kobalt‐ Aluminiumlegierunge n; Kupferlegierungen

Wilhlem Biltz

Zeitschrift für anorganische und allgemeine Chemie 134 (1) 25-36 (1924) · Wiley

DOI: 10.1002/zaac.19241340104

Data: JSON record · id doi:10.1002/zaac.19241340104 · metadata: crossref

Roles in ORCHID

• cited as the original source of values

Systems

Cu–Sn

Evidence in ORCHID

1 values in 1 other papers cite this work as their source.

Phase-registry phases citing it: phase:cu-sn:cu3sn-l

Availability

Read by ORCHID: no (full_text_screened_for_origin). Open-access licence (Crossref license field): none deposited. Crossref is-referenced-by count: 18 (retrieved 2026-10-23).

Relations

Cited by (Crossref reference lists) (4)

• Thermodynamic Reassessment of the Binary Cu-Sn, Cu-P, and Sn-P and Ternary Cu-Sn-P Systems (2024) [crossref_reference_list]
• First-principles calculations of binary Al compounds: Enthalpies of formation and elastic properties (2011) [crossref_reference_list]
• The Cu–Sn phase diagram part II: New thermodynamic assessment (2013) [crossref_reference_list]
• Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds (2007) [crossref_reference_list]

Cited for values by (1)

• The Cu–Sn phase diagram part II: New thermodynamic assessment (2013) — 1 values [orchid_extraction]

Used in (assessments / papers that took values from it) (1)

• The Cu–Sn phase diagram part II: New thermodynamic assessment (2013) — 1 values [orchid_extraction]